Продукты

DSM Somos PerFORM Stereolithography Polymer, Thermal Postcure

    • Название продукта: DSM Somos PerFORM Stereolithography Polymer, Thermal Postcure
    • Сайт Factroy: Округ Юду, Ганьчжоу, Цзянси, Китай
    • Запрос цены: admin@ascent-chem.com
    • Производитель: Ascent Petrochem Holdings Co., Limited
    • Свяжитесь сейчас
    Спецификации
    Код ТН ВЭД 709549

    Как аккредитованный DSM Somos PerFORM Stereolithography Polymer, Thermal Postcure завод, мы соблюдаем строгие протоколы качества - каждая партия подвергается строгим испытаниям для обеспечения последовательных стандартов эффективности и безопасности.

    Упаковка и хранение
    Упаковка
    Доставка
    Хранение
    Применение DSM Somos PerFORM Стереолитографический полимер, Термическое посткучение

    Specification of DSM Somos PerFORM Stereolithography Polymer in thermally postcured form for transonic wind tunnel test articles is driven by the need to machine pressure taps and maintain profile tolerance after thermal soak. The resin is printed on production stereolithography equipment with layer thicknesses between 50 μm and 100 μm; after the manufacturer-specified postcure cycle, the part exhibits anisotropic shrinkage that is dominated by build orientation. Vertical z-axis sections can show dimensional deviation greater than 0.15% compared with horizontal xy-plane sections. Because pressure-tapped models require orifice diameters from 0.5 mm to 1.0 mm, the filled resin’s low elongation at break imposes low drilling feed force, high spindle speed, and carbide tooling to avoid edge fracturing. The resin is processed as supplied; adding reactive diluents or colourants above trace levels alters ceramic filler dispersion and postcure shrinkage compensation. In subsonic and transonic campaigns, aerodynamic heating seldom exceeds 120 °C, which is below the published 0.46 MPa HDT after postcure; the mechanical load is primarily a pressure differential across thin walls, typically under 50 kPa. The critical failure mode in this service is not thermal softening but brittle fracture during machining, transport, or tunnel installation. First-article validation uses a calibrated coordinate measuring machine and pin gauges for pressure tap diameter; published orientation-dependent shrinkage data for this material on production-scale platforms is limited, so each build configuration is qualified with a sacrificial article.

    Injection Mould Insert Life Under Cyclic Clamp Pressure

    Short-run injection mould inserts manufactured from thermally postcured Somos PerFORM are restricted to unfilled or lightly filled thermoplastics with melt contact below 240 °C and cavity pressure below 40 MPa. The insert is mounted as a replaceable core in a steel or aluminium bolster rather than as a full mould plate because the flexural modulus of the photopolymer is high but its fracture tolerance is low. The thermal conductivity of the filled resin is lower than P20 steel; cycle time increases of 30–50% are typical unless conformal cooling lines are machined at a minimum wall thickness of 4 mm. The governing process conflict is the combination of cyclic clamp force and melt pressure, which produces bending stress in thin ribs and can initiate cracks at sharp corners. For glass-filled polyamide grades, cavity pressures of 30–40 MPa and abrasive filler cause surface wear and loss of feature sharpness; published comparative tool life data for this specific configuration is limited. Inserts must be fully postcured because a partially crosslinked core fails by internal delamination rather than surface wear. A draft angle of at least 1.5° and root radii above 0.8 mm reduce notch failures. On a 60 t injection moulding machine with a cavity pressure sensor, maximum shot count is established by progressive crack growth at gate and ejector pin locations.

    Process exposure thresholds for candidate downstream segments
    ApplicationPeak thermal exposureMechanical load at temperaturePrimary failure modeVerification anchor
    Injection mould insert240 °C melt contact20–40 MPa cavity pressureNotch cracking at rib rootsASTM D648-16
    Composite cure mandrel177 °C autoclave soak0.6–0.7 MPa autoclave pressureCreep at bag seal edgesISO 75-1:2020
    Solder pallet260 °C peak reflow<5 MPa flexural stressThermal shock microcrackingASTM D648-16
    Thermoforming plug130 °C sheet contact<1 MPa compressive stressSurface wearISO 178:2019

    When a Postcured Resin Substitutes for Machined Delrin in Autoclave Drill Fixtures

    Autoclave cure cycles for thin-ply carbon-epoxy laminates expose tooling to 121 °C to 177 °C at 0.6 MPa to 0.7 MPa. The thermally postcured resin has a lower coefficient of thermal expansion than unfilled stereolithography resins but still expands more than Invar or carbon fibre laminate. This mismatch is managed by designing mandrel shells with open lattice or segmented construction rather than solid monolithic cross-sections. On production-scale autoclave carts, the main failure mode is not bulk softening but creep at sharp vacuum bag edges and seal corners. Because postcured PerFORM is notch-sensitive, bag seal grooves are machined with edge radii above 0.5 mm; carbide burrs or electrical discharge machining are specified because hand trimming with utility blades can initiate microcracks. In drill fixture applications, the material replaces machined Delrin or aluminium for low-volume hole pattern transfer at 130 °C to 177 °C. Drill bushes are pressed into postcured parts with an interference fit of 0.03 mm to 0.05 mm; higher interference can cause radial cracking. Published creep data under full vacuum-bag compaction for this filled photopolymer is limited; tool surface qualification requires contact thermocouple mapping and post-cycle dimensional inspection.

    What Limits Solder Pallet Flatness During 260 °C Reflow Dwell?

    Lead-free wave solder pallets and reflow carriers produced from thermally postcured Somos PerFORM are applied in intermittent thermal service rather than continuous duty. During a reflow dwell at 260 °C for 30 s to 60 s, the primary mechanical load is the self-weight of the pallet and populated printed circuit board, producing a flexural stress below 5 MPa in a ribbed carrier design. The material remains below the postcured 0.46 MPa HDT, but the lower 1.82 MPa HDT indicates that thick unsupported spans and point loads must be avoided. Warpage after repeated cycling is controlled less by thermal decomposition than by residual green-state stress; incomplete postcure or rapid heating of a thick pallet can release built-in stress and produce out-of-plane distortion exceeding 0.5 mm across a 250 mm span. The pallet is placed on a flat CFRP or granite rest during cool-down to reduce distortion. The surface is not inherently solder-phobic; periodic application of a high-temperature photopolymer-compatible release agent is required. Pallet replacement is based on progressive surface microcracking from thermal shock, inspected at 10× magnification.

    Thermoforming plug assists for PET sheet are used at 120 °C to 130 °C sheet contact with compressive contact stress below 1 MPa; because the thermal and mechanical loads remain below the postcured 0.46 MPa HDT, the material is adequate for low-volume runs, but published creep data under radiant panel heat flux is limited.

    For prototype fluid flow manifolds in motorsport induction systems, the thermally postcured resin operates with inlet air temperatures from 80 °C to 120 °C and internal positive pressure below 0.2 MPa. The material is selected over machined aluminium for rapid iteration of internal flow paths. Internal channels printed with a 0.5 mm wall thickness are pressure-tested at 1.5× operating pressure using water or inert gas. Because the material is high-modulus and low-elongation, cyclic pressure pulses above 0.3 MPa are unsuitable; failure occurs as longitudinal cracking along layer interfaces. Manifold flanges are reinforced with steel compression limiters to avoid creep at bolted joints. The working fluid must be free of aromatic hydrocarbons; cooling fluids containing esters or chlorinated solvents may soften the polymer. A production-scale stereolithography platform with batch sizes of 4–6 parts per build is typical; part-to-part variation in flange flatness is controlled by post-machining on a vacuum plate.

    Verification standards for postcured Somos PerFORM downstream applications
    ParameterDesignationApplication relevance
    Heat deflection temperatureASTM D648-16 / ISO 75-1:2020Thermal service ceilings in wind tunnel, solder pallet and autoclave tooling
    Tensile modulus and elongationASTM D638-14Injection mould insert strength and brittle failure threshold
    Flexural modulusASTM D790-17 / ISO 178:2019Solder pallet and composite mandrel stiffness
    Izod impact strengthASTM D256-10Notch sensitivity at sharp machined corners
    Volume resistivityASTM D257-14Electrical connector insulator qualification

    When short-run electrical connector insulator bodies are required for hot-fluid environments, thermally postcured Somos PerFORM is used because the cycle increases dimensional stability and reduces creep under pin insertion loads. Connector pin retention is evaluated by inserting square pins of 0.64 mm cross-section into printed holes; retention force above 20 N is required. The low elongation at break makes snap-fit latches inappropriate; the material is configured as a rigid connector body with metal clips or screws. Moisture absorption at 50% RH is lower than unfilled photopolymers, but published data for automotive coolant immersion in this specific resin is limited. Qualification includes 100 thermal cycles from -40 °C to 105 °C and insulation resistance testing according to ASTM D257-14.

    Бесплатная цитата

    Конкурентные цены DSM Somos PerFORM Stereolithography Polymer, Thermal Postcure, которые соответствуют вашему бюджету - гибкие условия и индивидуальные котировки для каждого заказа.

    Для получения образцов, цен или более подробной информации свяжитесь с нами по адресу +8618136850665 или отправить по почте admin@ascent-chem.com.

    Мы ответим вам как можно скорее.

    Телефон: +8618136850665

    Электронная почта: admin@ascent-chem.com

    Запрос

    Получите бесплатную сметуAscent Petrochem Holdings Co., Limited

    Гибкие условия оплаты, конкурентоспособные цены, первоклассное обслуживание — обращайтесь прямо сейчас!

    Сертификация и соответствие требованиям
    Более подробное введение

    DSM Somos PerFORM is a high-solids, ceramic-filled stereolithography photopolymer supplied under the trade designation “Stereolithography Polymer, Thermal Postcure.” The material is formulated for vat polymerization at 355 nm solid-state laser wavelength; green parts are removed from the platform, cleaned, UV-postcured, and then thermally postcured to develop final thermal and mechanical properties. Manufacturer-published values after the full postcure sequence include tensile strength of 80 MPa tested to ASTM D638-14, tensile modulus of 10,500 MPa, flexural strength of 145 MPa tested to ASTM D790-17, and heat deflection temperature of 268 °C at 0.46 MPa tested to ASTM D648-16. The cured polymer displays brittle failure with elongation at break near 1.1%, density of approximately 1.61 g/cm³ tested to ASTM D792-20, and Shore hardness near 92 D. The material is distinguished from unfilled SL resins by high modulus, high HDT, and lower coefficient of thermal expansion; however, the ceramic filler introduces vat settling and recoater-handling constraints that are not present in clear or unfilled SLA formulations.

    How does the thermal postcure sequence shift conversion and heat deflection in a filled SL network?

    Green Somos PerFORM parts retain a proportion of unreacted acrylate and epoxy groups because photopolymerization stops at the gel point and leaves residual monomer trapped in the matrix. UV post-cure supplies photons to the part surface, but the ceramic filler scatters light and limits depth penetration. Thermal postcure, commonly specified at 150 °C for 2 h after UV exposure, raises segmental mobility and drives diffusion-limited conversion. Increase in crosslink density reduces residual monomer concentration and raises the glass transition temperature. Manufacturer-published HDT values show the effect of loading: at 0.46 MPa the postcured material reaches 268 °C, while at 1.81 MPa the value is approximately 160 °C. The separation between these two conditions is a practical indicator that the material retains form at low stress but may creep at elevated stress near the glass transition. Published DMA data for the specific formulation is limited, but the observed HDT spread is consistent with a highly crosslinked network containing rigid particulate reinforcement. Users measuring Tg by DMA often report a dry-state peak in the range of 130–135 °C; this value should not be treated as a service temperature because the filled network can carry load above Tg at low stress through particle reinforcement and crosslink density.

    Thermal postcure is not a simple drying step. Oven load geometry, airflow, and ramp rate influence final part properties. A ramp of 2–5 °C/min reduces thermal gradient stresses in thick sections; parts over 25 mm thick are preferably staged at 90–100 °C for 1 h before the final 150 °C soak. Calibrated forced-air ovens with a maximum temperature deviation of ±5 °C are used for HDT-critical parts. Solid trays can block airflow and create cold spots; perforated metal fixtures support parts during postcure. Parts are cooled to below 60 °C before removal from fixtures to reduce thermal distortion. Parts with variable wall thickness can develop internal stress during thermal postcure because thick sections heat more slowly than thin sections. For HDT-critical geometries, production facilities map oven temperature with a validated thermocouple array and adjust airflow baffles to maintain uniformity.

    Table 1 summarizes manufacturer-published typical cured properties after UV and thermal postcure.

    PropertyValueTest method
    Tensile strength80 MPaASTM D638-14
    Tensile modulus10,500 MPaASTM D638-14
    Elongation at break1.1%ASTM D638-14
    Flexural strength145 MPaASTM D790-17
    Flexural modulus9,800 MPaASTM D790-17
    HDT at 0.46 MPa268 °CASTM D648-16
    HDT at 1.81 MPa160 °CASTM D648-16
    Water absorption, 24 h0.35%ASTM D570-98
    Density, cured1.61 g/cm³ASTM D792-20

    Recoater dynamics and high-solids handling in production vat polymerization

    Somos PerFORM exhibits a viscosity near 1,200 mPa·s at 30 °C, compatible with standard recoater blade or roller systems on commercial SLA platforms. The filled resin scatters UV light more strongly than unfilled SL formulations; therefore, cure depth at a given laser power is reduced. Equipment with nominal laser power below 250 mW may require reduced scan speed or larger layer thickness to maintain adequate cure. Layer thicknesses of 50 µm or 100 µm are commonly used. Green-part stiffness is sufficient to support thin walls, but low green elongation can cause cracking during part removal from the platform if support structures are under-designed. The filler phase settles over time. Vats left idle for periods longer than 8 h should be re-circulated before starting the next build. Production lines use a flat recoater blade with a gap setting above the build plane; excessive blade force can compact settled filler into the build surface, while insufficient force produces non-uniform layer thickness. Batch-to-batch viscosity is checked with a rotational viscometer before release. Storage containers should remain sealed at 5–30 °C and below 60% relative humidity.

    Layer orientation affects cured properties. Parts printed with long axes parallel to the recoater direction generally exhibit lower variation in tensile modulus along the build direction than parts oriented perpendicular to the recoater stroke, although published data for this specific configuration is limited. Standard practice orients parts at a shallow angle to the build plane to reduce stair-step finish and places critical surfaces away from support regions. For sections thicker than 25 mm, reduced ramp rates during thermal postcure reduce internal stress gradients.

    Failure modes on production lines include z-axis delamination and surface pitting. Z-axis delamination is commonly traced to filler settling or insufficient UV dose at the layer interface. Surface pitting is observed when the recoat blade drags agglomerated filler across the build surface. These defects become visible after thermal postcure because differential shrinkage opens microcracks at filler-poor regions. Incoming resin lots are therefore pre-screened by building a small test coupon and measuring flexural modulus before release to production.

    Application demand for Somos PerFORM is concentrated in production environments where unfilled SL resins soften or distort under thermal load. Wind tunnel test models are built with 100 µm layer thickness, UV-postcured, thermally postcured, and then machined and polished. The filler content contributes to lower linear shrinkage than unfilled resins; users report total linear shrinkage after full postcure in the range of 0.1–0.3% on long axes, but published data for specific geometries is limited. Dimensional inspection with a coordinate measuring machine after thermal postcure is standard practice because shrinkage is anisotropic. The low elongation at break requires careful support placement on thin leading edges; cracks can initiate at sharp corners during support removal if the part is not fully postcured. For composite layup tooling, the printed tool is often sealed with a chemically resistant coating to prevent epoxy or styrene diffusion into surface microvoids. A tool used for oven cure of carbon-fiber prepreg at 120–150 °C should be dry-baked before first use to remove residual volatiles. Tooling surfaces have been operated at low autoclave pressures, but the user must verify that the pressure and temperature combination does not exceed the 1.81 MPa HDT limit of 160 °C under sustained load.

    Injection mold inserts printed from PerFORM have been used for short-run polypropylene or acrylonitrile butadiene styrene molding, but published cycle-life data for this application remains limited. The high filler content reduces wear during low-pressure molding, but ejection pins and clamping forces must be re-evaluated because the polymer composite has lower toughness than tool steels. Mold inserts are usually limited to prototype shot counts below 100 cycles unless reinforced with metal frames. For inserts, thermal postcure is mandatory; skipping it produces soft regions that deform under pack pressure.

    When autoclave tooling demands thermal cycling stability at low pressure

    Autoclave cure cycles place the tool under combined temperature, vacuum, and autoclave pressure. Somos PerFORM tooling is generally applied to low-pressure cure cycles below 0.7 MPa gas pressure and tool temperatures up to approximately 150 °C. The postcured HDT at 0.46 MPa of 268 °C is not the only design parameter; at 1.81 MPa the HDT falls to 160 °C. Tool surfaces above 160 °C under autoclave pressure may show localized creep at sharp corners and at vacuum-bag seal lines. CTE values published for the postcured material are between 45 µm/m·°C and 85 µm/m·°C depending on temperature interval, lower than unfilled SLA resins but higher than aluminum at 23 µm/m·°C. A 500 mm tool section raised by 100 °C expands by approximately 3.8 mm at a CTE of 75 µm/m·°C; matched tooling must accommodate this differential.

    Vacuum-bag sealing against a PerFORM tool surface requires sealing after postcure because microcracks may form during thermal cycling. Dye-penetrant inspection after each autoclave run is used in production to detect crack growth before laminate contamination occurs. Thermal cycling between 20 °C and 150 °C shows stable HDT retention in properly postcured parts; published long-term cycling data for this specific configuration is limited, and first-article validation is required. Tools exposed repeatedly to 180 °C should be inspected for surface oxidation and microcracking at corners. The resin is not recommended for continuous service above 180 °C under mechanical load because creep accumulates and the 1.81 MPa HDT is insufficient.

    Filled versus unfilled resin families show opposing failure modes

    Somos PerFORM differs from unfilled high-temperature SL resins in both filler content and postcure response. Compared with Somos ProtoTherm 12120, a high-temperature unfilled resin with published 0.46 MPa HDT near 121 °C, PerFORM raises the 0.46 MPa HDT to 268 °C and increases tensile modulus from approximately 3,200 MPa to 10,500 MPa. The trade-off is lower elongation; ProtoTherm 12120 published elongation at break is higher, while PerFORM is near 1.1%. Compared with Somos NeXt, a high-impact unfilled resin, PerFORM provides significantly higher modulus and HDT but loses the ductility required for snap-fit assemblies. NeXt published tensile modulus is approximately 2,400 MPa, with elongation at break above 10%, while PerFORM brittle failure occurs at 1.1%. Compared with WaterShed XC 11122, a clear unfilled resin with 0.46 MPa HDT near 86 °C, PerFORM is opaque, denser, and more heat resistant. The ceramic filler reduces postcure curl and improves edge retention during machining, but it increases vat settling and requires recirculation before each build.

    The coefficient of thermal expansion for Somos PerFORM is lower than typical unfilled SL resins. Published values are reported between 45 µm/m·°C and 85 µm/m·°C depending on the temperature interval, whereas unfilled resins often exceed 100 µm/m·°C above Tg. This lower CTE reduces thermal stress at the bond line when the polymer is used as a lightweight tool insert in a metal frame. However, the CTE remains higher than aluminum; a 500 mm tool section raised by 100 °C expands by approximately 3.8 mm at a CTE of 75 µm/m·°C. This differential must be accommodated by clearance fit or by designing the tool as a free-standing shell rather than a mechanically fixed insert.

    Published data for specific application performance in high-temperature molding is limited. The material should not be used with amine-based solvents or aggressive ketone cleaning agents because solvent ingress can induce microcracking. Moisture absorption at 24 h is low at 0.35% tested to ASTM D570-98, but prolonged immersion may plasticize the surface and reduce HDT. The filled resin has higher density and lower toughness than unfilled resins; components requiring impact resistance or snap-fit behavior should use an unfilled engineering resin unless the thermal requirement is overriding. Operators handling uncured resin must use nitrile gloves and follow SDS protocols because the liquid is a skin and eye irritant. Uncured resin spills should be cleaned with solvent and not allowed to cure on equipment surfaces.

    ТОП