DSM Somos ProtoGen™ 18120 Epoxy Resin for Stereolithography, UV & Thermal Postcure
- Название продукта: DSM Somos ProtoGen™ 18120 Epoxy Resin for Stereolithography, UV & Thermal Postcure
- Сайт Factroy: Округ Юду, Ганьчжоу, Цзянси, Китай
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- Производитель: Ascent Petrochem Holdings Co., Limited
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- DSM Somos ProtoGen™ 18120 Epoxy Resin for Stereolithography, UV & Thermal Postcure is typically used in formulations when resin viscosity and photoreactivity and UV/thermal postcure parameters must be controlled within specific ranges.
| Код ТН ВЭД | 726444 |
Как аккредитованный завод DSM Somos ProtoGen™ 18120 для эпоксидной смолы для стереолитографии, ультрафиолетового и термического посткуирования, мы соблюдаем строгие протоколы качества - каждая партия подвергается строгим испытаниям для обеспечения последовательных стандартов эффективности и безопасности.
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What regulatory boundary separates transient-use anatomical models from implantable resin articles?
Hospital additive manufacturing laboratories that produce craniofacial and maxillofacial planning models from ProtoGen 18120 must first classify the device contact boundary under ISO 10993-1:2018. A resin model used only against intact skin for less than 24 h falls into the limited-duration surface-contacting device category, which normally triggers cytotoxicity testing per ISO 10993-5:2009 and sensitization testing per ISO 10993-10:2010. The resin supplier's lot-specific certificate should be linked to the facility QMS under ISO 13485:2016, and the build process must be documented with the postcure protocol: 350–400 nm UVA at 30 mW/cm² for 60 min plus 80 °C ± 5 °C for 2 h. Because unfilled epoxy SLA parts are not autoclave-stable at 121 °C, low-temperature ethylene oxide sterilization is preferred, with aeration time extended to 24 h at 40 °C after exposure. Dimensional validation on a coordinate measuring machine with a maximum permissible error of ±0.005 mm should be performed on anatomical landmarks before and after sterilization to detect anisotropic shrinkage above 0.3 %. Published data for the exact shrinkage of ProtoGen 18120 after ethylene oxide processing is limited; therefore, the hospital QMS should require a five-part validation batch per ISO 13485:2016. The numerical output of the residual solvent extraction study under ISO 10993-18:2020 should be reviewed if the model will be used in an operating room for longer than 1 h.
Platinum-catalyzed RTV-2 inhibition is a recurring failure mode on partially cured epoxy patterns.
Vacuum casting of polyurethane or low-shore silicone parts using a ProtoGen 18120 master pattern requires the pattern surface to reach a completeness of cure that minimizes residual oxirane oligomer or cationic photoinitiator decomposition products capable of poisoning the platinum catalyst in addition-cure RTV-2 silicones. A master pattern should be postcured in two stages: first under 350–400 nm UVA at 30 mW/cm² for 60 min, then in a forced-air oven at 80 °C ± 5 °C for 2 h, followed by a 24 h resting period at 23 °C ± 2 °C before silicone contact. When using a platinum-cure silicone with Shore A hardness of 20–40, surface inhibition appears as a tacky gel layer up to 0.5 mm thick within 24 h. To prevent this, the master can be coated with a 10–20 μm acrylic lacquer or an aqueous polyvinyl alcohol film dried at 40 °C for 30 min, which acts as a physical barrier without altering the 0.1 mm dimensional tolerance required for the silicone cavity. Process validation should include Fourier-transform infrared attenuated total reflectance collection between 1500 cm⁻¹ and 600 cm⁻¹ to document the absence of unconverted resin bands; if the 915 cm⁻¹ oxirane absorbance is greater than 5 % of its postcure baseline value, the master is rejected. Tin-cure condensation silicones are less sensitive to catalyst poisoning but have higher linear shrinkage, typically 0.8–1.5 %, and are unsuitable for master geometries tighter than ±0.1 mm. Published data for the specific inhibition behavior of ProtoGen 18120 with commercial RTV-2 systems is limited; therefore, a 25 mm × 25 mm × 2 mm coupon compatibility test per silicone manufacturer instructions is required before committing to a full mold box.
| Stage | Control parameter | Equipment/standard | Acceptance window |
|---|---|---|---|
| UV postcure | UVA irradiance | UV flood chamber at 350–400 nm, radiometer per ISO/IEC 17025 | 20–40 mW/cm² for 60 min |
| Thermal postcure | Oven temperature uniformity | Forced-air oven, ASTM E145-21 | 80 °C ± 5 °C for 2 h |
| Conditioning | Temperature and relative humidity | ISO 291 | 23 °C ± 2 °C, 50 % ± 5 % RH for 24 h |
| Dimensional verification | Linear drift | CMM per ISO 10360-5 | < 0.02 % per 24 h after initial plateau |
Investment casting patterns for A356 aluminum impellers and shrouded turbocharger wheels can be fabricated using a 355 nm Nd:YVO₄ stereolithography platform equipped with a 0.13 mm focused beam diameter and a recoat blade set for 50 μm layer thickness. ProtoGen 18120 epoxy resin is typically processed at a bath temperature of 30 °C ± 2 °C, where its viscosity below 350 cP permits consistent recoat and drainage from internal cavity sections when drain holes of at least 3.0 mm diameter are modeled into the pattern. The wax-free burnout process requires the ceramic shell to be built with colloidal silica slurry and zircon or fused silica stucco in at least 6 coats, followed by steam autoclave dewax at 150 °C ± 10 °C and 4–6 bar. The epoxy pattern expands during autoclave prior to burning; printed patterns with solid cross-sections above 8 mm thickness may therefore crack the shell unless internal honeycomb or triangular lattice structures are applied with a wall thickness of 1.5–2.0 mm. During burnout, the kiln ramp from 300 °C to 900 °C should not exceed 3 °C/min to allow decomposition gases to escape through the shell pores, and the final hold at 900 °C for 2 h reduces carbon residue. Published data for ProtoGen 18120-specific ash residue at 800 °C is limited, so foundries relying on this material for aerospace nickel alloy castings are advised to quantify tray ash per ASTM D482 on a representative pattern batch before committing to shell line qualification.
Under-hood thermal cycling evaluations on snap-fit cable retainers and sensor brackets begin with a layer thickness of 100 μm on a 355 nm SLA machine, although 50 μm layers are preferred when snap features below 1.5 mm width must survive repeated insertion. Tensile bars printed in the XY plane and tested per ASTM D638-14 after UV and thermal postcure typically show a tensile modulus in the low GPa range and elongation at break below 15 %, which restricts living-hinge designs and demands that snap arms incorporate a corner radius of at least 1.5 mm and a beam length-to-thickness ratio above 5:1. Heat deflection temperature under ASTM D648 Method B at 0.455 MPa is not sufficient for continuous exposure to cylinder head environments above 85 °C; functional validation should therefore be limited to short thermal soaks of 2 h at 85 °C and repeated cycling between -40 °C and 85 °C for 50 cycles. When brass heat-stake inserts are installed into printed bosses, hole diameter must be adjusted according to the insert manufacturer's recommended interference, typically 0.25–0.35 mm, because the unfilled epoxy matrix does not flow plastically like glass-filled nylon. The low-viscosity resin permits thin rib sections down to 0.8 mm; however, rib bases should transition to the nominal wall with a 0.5 mm radius to prevent stress concentration. Batch-to-batch variation in the postcured flexural modulus should be checked by ASTM D790-17 at 23 °C ± 2 °C and 50 % relative humidity after conditioning per ISO 291; published results for this specific configuration are limited, so internal reference specimens are necessary.
When glow-wire and creepage data must be extracted from unfilled epoxy enclosures
Prototype electrical housings printed from ProtoGen 18120 are evaluated for ignition resistance under IEC 60695-2-11:2014 at glow-wire temperatures of 650 °C and 750 °C, but the material is not a V-0 compound and typically performs as an HB classification at 3.0 mm wall thickness under UL 94. Designers should therefore not claim a flame-retardant rating on production enclosures and should keep internal heat sources at least 3 mm away from the wall. Comparative tracking index can be measured per IEC 60112:2009 at 175 V and 250 V; because unfilled epoxy surfaces are hygroscopic after 48 h at 93 % relative humidity, the CTI may drop by one or two categories, so preconditioning per the standard is mandatory. Creepage and clearance distances are taken from IEC 60664-1:2020 for pollution degree 2 and overvoltage category II, but the printed wall must be re-measured after UV/thermal postcure to detect warpage beyond 0.3 % of the longest dimension. The 50 μm layer line roughness on surfaces perpendicular to the build direction can be as high as 5–15 μm Ra; sanding to 400 grit or dry glass bead blasting at 2 bar is applied before paint in order to avoid tracking along surface grooves. Published data for the exact CTI of ProtoGen 18120 in this configuration is limited, so the certifying laboratory should generate a 10-specimen dataset to document mean CTI and standard deviation before issuing a final test report.
For low-pressure pneumatic manifold prototypes that operate below 2 bar and at ambient temperature, ProtoGen 18120 can be used when internal channels are designed with a minimum diameter of 2.0 mm and a straight-line path to permit solvent draining during post-processing. The green part is first immersed in a 99.9 % isopropyl alcohol bath at 25 °C for 20 min with ultrasonic agitation at 40 kHz, then rinsed in fresh solvent for 10 min to remove uncured resin from the channel walls. Water washing is avoided because residual moisture can plasticize the epoxy network and reduce glass transition temperature; instead, compressed air at 1.5 bar is blown through the channels for 3 min before postcure. The postcure protocol of 60 min UVA at 350–400 nm followed by 80 °C ± 5 °C for 2 h in a convection oven is run with the part inverted every 30 min to prevent residual liquid from pooling in blind pockets. Chemical resistance is tested per ISO 175:2010 after 7 days immersion in mineral oil, ethylene glycol, and 10 wt% sodium chloride solution at 23 °C; exposure to ketones, chlorinated solvents, and strong bases should be avoided because they attack the cured epoxy network and can induce swelling above 5 % by mass. Published data for the long-term hydrolytic stability of this particular resin is limited; however, a pressure leak test at 2 bar with nitrogen gas should be repeated after 7 days of 85 % relative humidity at 40 °C to confirm channel integrity.
Assembly jig dimensional stability and the 24-hour postcure shrinkage plateau
Coordinate measuring machine fixtures and assembly jigs printed from ProtoGen 18120 require a stabilization period after the thermal postcure before final dimensional certification. Following UV postcure at 350–400 nm for 60 min and forced-air thermal cure at 80 °C ± 5 °C for 2 h, the part continues to undergo low-level shrinkage as residual polymerization and physical aging proceed; measurements made with a contact CMM with a maximum permissible error of ±0.005 mm typically show that the majority of linear drift occurs within the first 24 h at 23 °C ± 2 °C and 50 % ± 5 % relative humidity, after which the change per 24 h falls below 0.02 %. Jigs are therefore fixtured in a controlled metrology laboratory conditioned per ISO 291 before dimensional acceptance, and any bolt-tightening locations are countersunk with a 0.5 mm chamfer to prevent surface crushing. The coefficient of thermal expansion between 23 °C and 50 °C should be measured on a thermomechanical analyzer using a 3 mm thick specimen; unless the expansion is compensated, a 200 mm long jig can drift by over 0.1 mm in a 10 °C ambient shift, which exceeds the tolerance band for many automotive CMM fixtures. Published data for this specific resin configuration is limited, so final inspection should use a 5-part fixture batch and evaluate the ISO 10360-5 single-point articulation uncertainty to ensure measurement capability is at least 4:1 against the printed feature tolerance. The material is not suitable for jigs exposed to continuous temperatures above 65 °C because creep under a 5 MPa compressive load can exceed 0.2 % within 24 h.
Конкурентоспособные цены на эпоксидную смолу DSM Somos ProtoGen™ 18120 для стереолитографии, ультрафиолетовой и термической последующей обработки, которые соответствуют вашему бюджету - гибкие условия и индивидуальные котировки для каждого заказа.
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- DSM Somos ProtoGen™ 18120 Epoxy Resin for Stereolithography, UV & Thermal Postcure Производится в соответствии с системой качества ISO 9001 и отвечает соответствующим нормативным требованиям.
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Somos ProtoGen™ 18120 is a single-component epoxy-based photopolymer formulated for stereolithography systems equipped with 355 nm solid-state lasers. The product is supplied as a low-viscosity liquid resin that forms a green part during laser exposure and achieves final thermomechanical properties only after a combined UV and thermal postcure sequence. Manufacturer-published liquid-state data place the density at approximately 1.16 g/cm³ at 25 °C and the viscosity in the range of 250–300 mPa·s at 30 °C. Because the formulation is epoxy-based, the polymer network develops through cationic polymerization during laser exposure and continues to crosslink during UV flood exposure and thermal annealing. The material is intended for stereolithography builds that require elevated-temperature stiffness, low moisture uptake, and dimensional stability in functionally loaded prototypes, tooling, and short-run components.
The model designation ProtoGen 18120 identifies this specific epoxy chemistry in the Somos resin portfolio. The resin is not a general-purpose acrylate photopolymer; its postcure protocol and handling conditions differ from those of acrylate-based resins, particularly with respect to thermal cure demand and moisture sensitivity prior to cure.
What Processing Parameters Govern the Use of ProtoGen 18120 in Stereolithography?
The liquid resin is maintained at an elevated vat temperature, commonly 28–32 °C. At 30 °C the viscosity permits recoating blades to level layers without excessive carry-over. If the vat temperature falls below 27 °C, the increase in viscosity can produce inconsistent layer thickness; if it exceeds 35 °C, the dark stability of the resin may be affected. Build parameters are matched to a 355 nm solid-state laser. Typical layer thicknesses are 50 μm or 100 μm, although thicker layers up to 150 μm may be used for parts with large flat cross-sections. The required exposure is determined by critical energy and penetration depth; the epoxy formulation exhibits a moderate penetration depth that supports fine detail when layer thickness is held at or below 100 μm. Parts with thin walls and fine features require reduced layer thickness and lower recoating speed.
After the build, the green part is removed from the platform and washed in a two-stage solvent bath. Common wash solvents for epoxy stereolithography resins are tripropylene glycol monomethyl ether and isopropanol. The first stage removes bulk liquid resin, and the second stage removes residual film from fine recesses. Residual solvent must be evaporated before UV postcure because solvent plasticizes the polymer and reduces conversion. On production-scale platforms with dual-edge recoating, 100 μm layer builds of thin-wall housings are reported to be acceptable when support tips are set to lower exposure values.
Green-state strength in epoxy stereolithography resins is lower than final cured strength. Support structures must be placed to resist peel forces during recoating layers. Feature sizes below 0.5 mm may require reduced laser exposure and lower recoating speed to prevent deformation of the green lip. On platforms using a wiper blade, parts with large flat cross-sections oriented parallel to the resin surface generate higher peel forces than angled or vertically oriented parts. In cationic epoxy photopolymerization, initiation is produced by photocationic acid generation from an initiator system; propagation occurs during laser exposure and continues in the dark after illumination ceases. The dark-cure component is significant for green-strength development but also places an upper limit on vat residence time at elevated temperature. The viscosity of the resin is near-Newtonian under typical recoating shear rates; this reduces layer-to-layer thickness variation when blade speed is changed. Critical exposure and penetration depth values are specific to laser spot size and layer thickness; they are supplied in machine-specific build parameter files rather than as universal constants.
After postcure, the cured resin is characterized by a tensile modulus and heat deflection temperature that distinguish it from unfilled acrylate stereolithography resins. The following typical values are derived from manufacturer-published data and apply to fully postcured specimens; they are not specification minima.
| Property | Typical value | Test method |
|---|---|---|
| Tensile strength | 73 MPa | ASTM D638-14 |
| Tensile modulus | 2,600 MPa | ASTM D638-14 |
| Elongation at break | 7 % | ASTM D638-14 |
| Flexural strength | 120 MPa | ASTM D790-10 |
| Flexural modulus | 2,700 MPa | ASTM D790-10 |
| Notched Izod impact | 32 J/m | ASTM D256-10 |
| Heat deflection temperature at 0.46 MPa | 122 °C | ASTM D648-07 |
| Heat deflection temperature at 1.82 MPa | 105 °C | ASTM D648-07 |
| Water absorption, 24 h | 0.35 % | ASTM D570-98 |
The cured network is a stiff epoxy thermoset with limited elongation. The combination of 105 °C heat deflection temperature at 1.82 MPa and low water uptake makes it suitable for short-duration thermal exposure in fasteners, connectors, and underhood prototype brackets. The values are generated on specimens that are built, washed, UV postcured, and thermally postcured according to manufacturer-specified procedures. Variation in postcure dose, oven temperature uniformity, and build orientation shifts these values.
When Thermal Postcure Is Shortened, Residual Conversion and Dimensional Stability Are Affected
Green-state parts contain unreacted epoxide groups and are relatively brittle and solvent-sensitive. If thermal postcure is omitted, the final network conversion remains below the designed value. The glass transition temperature is depressed, and the part may exhibit higher creep under sustained load and greater moisture sorption. The recommended postcure sequence involves a UV flood chamber that exposes all surfaces to UV radiation, typically in the 320–400 nm range, followed by a forced-air or convection oven thermal step.
Because UV dose distribution varies with chamber lamp configuration, parts should be rotated and shadowed surfaces re-exposed. The thermal step is commonly performed at 80–120 °C for durations of 1–3 h, depending on part mass and wall thickness. The exact schedule should be taken from the current product technical data sheet because lot-specific adjustments may exist. Forced-air ovens are typical; vacuum or inert-gas thermal postcure is not required but may reduce surface oxidation. The oven load should be arranged to avoid stacked parts that shade UV during the UV step and to allow uniform air movement during the thermal step. Thermal postcure ovens should be validated with a calibrated load thermocouple to confirm that the center of the thickest part reaches the specified temperature for the required duration. Airflow shadowing can produce undercured regions that are not visually distinct. For lot-to-lot control, a hardness or glass transition check on a standard specimen is preferred because residual conversion is difficult to measure directly on production parts.
Thick sections act as thermal sinks; oven ramp-up must be controlled to avoid overshoot that could induce distortion. If thermal postcure is shortened, residual cationic species may remain active, causing slow property evolution over weeks. Differential conversion through the wall can produce internal stress after thermal postcure; tooling builds therefore require pre-scaling of critical dimensions using process capability data from the specific stereolithography platform. Published data for this specific configuration is limited.
Relative to acrylate-based stereolithography resins, ProtoGen 18120 offers a higher heat deflection temperature and lower long-term moisture absorption, but it has lower elongation at break and requires more rigorous postcure. Compared with heavily filled high-temperature stereolithography resins, it has lower viscosity and finer feature resolution but lower abrasive wear resistance and lower maximum service temperature. Compared with an unfilled acrylate photopolymer of similar modulus, the epoxy network in ProtoGen 18120 typically exhibits different failure behavior: higher crosslink density yields higher heat deflection temperature but also lower impact toughness. The low liquid viscosity of 250–300 mPa·s is closer to low-viscosity acrylate resins than to many high-temperature epoxy stereolithography resins that can exceed 1,000 mPa·s at 30 °C; this is the primary processing difference that reduces vat drain time and supports fine-feature recoating. However, the thermal postcure demand is higher than that of many acrylate systems, which may require only UV exposure.
Electrical connector housings and automotive sensor enclosures built from the resin have been evaluated for short-term exposure at temperatures up to 105 °C without softening under the 1.82 MPa heat deflection temperature limit. Creep experiments performed per ASTM D2990 are recommended for continuous load at elevated temperature; published data for this specific configuration is limited. The resin has been used for silicone RTV mold masters, where low surface roughness and dimensional stability after postcure allow multiple casting cycles. The molds should be sealed with a suitable mold release because uncured silicone may bond to epoxy surfaces if left in contact for extended periods.
Moisture Uptake, Chemical Resistance, and Long-Term Dimensional Drift
The cured material exhibits water absorption of 0.35 % after 24 h immersion per ASTM D570-98. This value is lower than many unfilled acrylate-based stereolithography resins, but the material is not hydrophobic. Continuous exposure to high humidity can still produce slight dimensional growth. Components intended for tight-tolerance optical or mechanical assemblies should be conditioned to the service environment before critical dimension verification. Dimensional measurements on conditioned specimens are typically performed after 24 h equilibration at 23 °C and 50 % relative humidity. For parts with critical interfaces, postcure dimensional compensation should be determined by measuring a known artifact on the same equipment, not assumed from nominal resin shrinkage.
The epoxy network is resistant to mild aqueous solutions and many hydrocarbon fluids, but polar organic solvents and chlorinated solvents may attack the thermoset. The epoxy thermoset is also resistant to dilute acidic solutions and aliphatic hydrocarbons, but exposure to aromatic hydrocarbons and ketones can produce swelling. The affected layer is usually the surface; thin-section parts are more susceptible to property loss. Compatibility testing per ASTM D543 or ISO 175 is required before use with proprietary process fluids. The resin is not recommended for prolonged immersion in strong bases or ketones unless validated. A postcure oven with adequate temperature uniformity minimizes residual acid species that can accelerate hydrolytic degradation in humid environments. Fully postcured materials have low creep at temperatures below the glass transition. However, at service temperatures above 80 °C under continuous load, creep compliance increases; the design should use the appropriate creep modulus for the load duration. Because the material is thermoset, it does not exhibit the viscous flow of semi-crystalline thermoplastics; dimensional change under load is dominated by viscoelastic creep rather than creep rupture in the short term.
The operational boundaries of the liquid resin should be observed. The resin should be stored in the original opaque container at 20–25 °C; exposure to light or temperatures above 35 °C can initiate premature polymerization or increase viscosity. Moisture contamination from humid air should be minimized because water can disrupt cationic cure and reduce conversion. The resin is not supplied as a food-contact material, and any medical or food-contact application must be verified against the relevant regulatory requirements, such as USP Class VI or FDA 21 CFR 177, as applicable. The uncured resin is a skin and respiratory irritant; handling should follow the safety data sheet with nitrile gloves and local exhaust ventilation. Avoid mixing with amine-based or metallic additives that may inhibit cationic polymerization or destabilize the liquid resin. The manufacturer’s regulatory data sheets identify compliance status with REACH and RoHS at the date of supply; current status should be confirmed through the supply chain.
