| Код ТН ВЭД | 823944 |
Как аккредитованный завод Ensinger TECAFIL PEEK EV натуральный - 1,75 мм - полиэфирэтеркетон, мы соблюдаем строгие протоколы качества - каждая партия подвергается строгим испытаниям для обеспечения последовательных стандартов эффективности и безопасности.
| Упаковка | |
| Доставка | |
| Хранение |
In enclosed aerospace cabin environments, Ensinger TECAFIL PEEK EV natural filament, a 1.75 mm unfilled polyetheretherketone with 0 wt% flame-retardant additive load, is processed into air distribution duct brackets, cable clamp blocks, galley latch housings, and stowage door wear strips through high-temperature fused filament fabrication. The material must satisfy 14 CFR 25.853(a) vertical burn requirements with a self-extinguishing time not exceeding 15 s and a burn length not exceeding 152 mm when tested on the worst-case printed thickness and build orientation. For larger panels adjacent to occupied zones, 14 CFR 25.853(d) heat release and smoke density are evaluated under ASTM E662-19, with peak heat release limited to 65 kW/m² and specific smoke density typically below 200 Ds within 4 min for vendor-qualified natural PEEK sheet and printed coupons. However, the printed part, not the raw filament, constitutes the certified article; layer-driven surface roughness, crystallinity gradients, and void population shift the burn and smoke response compared with extruded or injection-moulded stock, so each geometry must be tested after the same annealing and machining sequence used in production.
Feedstock formulation for this segment is fixed at 100 wt% virgin unfilled PEEK, with 0 wt% glass fibre, 0 wt% carbon black, and 0 wt% halogenated or phosphorus flame-retardant additive; the burn compliance derives from the chain structure of polyetheretherketone rather than additive synergy. The filament is dried at 150 °C for 4 h in a forced-air oven to reduce residual moisture below 0.02 wt% before extrusion through a hardened steel nozzle of 0.4 mm diameter at 400–430 °C, with the build plate held at 130–150 °C and the chamber actively heated to 160–200 °C. Layer height is typically 0.15–0.20 mm; thicker layers reduce interlayer cohesion in thin-section burn specimens. After printing, stress-relief annealing is performed at 200 °C for 2 h in a circulating-air oven, followed by slow cooling at ≤ 30 K/h to avoid amorphous skin retention and warpage-induced delamination. The major production-floor failure modes are part lift from polyetherimide build sheets when chamber temperature falls below 143 °C, and nozzle blockage caused by partially melted particles when print temperature is below 400 °C.
| Compliance property | Test method | Threshold | Printed specimen condition |
|---|---|---|---|
| Vertical burn | 14 CFR 25.853(a) | ≤ 15 s extinguishing, ≤ 152 mm burn length | Conditioned at 23 °C/50 % RH for 24 h |
| Heat release | 14 CFR 25.853(d) / ASTM E906-22 | Peak ≤ 65 kW/m² | Worst-case printed thickness and orientation |
| Smoke density | ASTM E662-19 | Ds ≤ 200 at 4 min | Annealed and machined |
| Tensile modulus | ISO 527-2/1B/5 | Vendor datasheet reference value | XY build orientation, 23 °C |
Terminal components in this scenario include cabin air duct brackets, wire harness clamp blocks, galley latch housings, stowage door wear strips, and tray-table arm covers. The unfilled grade retains a narrow processing window: chamber temperatures above 200 °C can cause excessive crystallinity and dimensional drift, while temperatures below 160 °C reduce layer fusion and lower burn-test repeatability across a multi-part build plate.
For reusable surgical instrument handles, sterilisation trays, and endoscope holder brackets, the relevant biocompatibility path is ISO 10993-5:2009 for cytotoxicity and ISO 10993-10:2010 for sensitisation and irritation, using extraction fluids conditioned to the final printed surface. Raw resin compliance does not transfer automatically to a fused-filament part because layer boundaries generate microvoids that can retain process fluids or cleaning residues. The feedstock is 100 wt% virgin unfilled PEEK; no plasticiser, biocide, release agent, or colourant is added at the filament spool. If the device is intended for upper-tissue contact, testing on the exact printed and machined geometry is required; published data for this specific configuration is limited for long-term implant use, and the natural PEEK filament is not promoted as an implantable grade unless a vendor-managed material certification is issued for the lot.
Thermal processing for reusable medical components uses a 0.4 mm hardened nozzle at 400–420 °C, a build chamber at 180 °C, and a 0.15 mm layer height with 100 % rectilinear infill to reduce void channels along the load path. After build, parts are annealed at 200 °C for 2 h to raise crystallinity and dimensionally stabilise the polymer before machining of sealing surfaces. The critical operational boundary is saturated steam autoclaving at 134 °C with 3 min holding time; repeated cycling beyond 250 cycles may expose delamination-prone layer interfaces if the chamber temperature during build was below 160 °C. In manufacturing audits, handles printed with insufficient chamber heating show whitening at interlayer zones after 100 cycles, which corresponds to micro-crazing rather than bulk chemical attack. Terminal components include reusable forceps handles, retractor cradles, sterilisation tray brackets, and probe calibration fixtures.
When a wafer cassette is cycled through a 180 °C vacuum bake and then transferred by ceramic-bladed end effectors, the material selection is driven by outgassing, dimensional stability, and particulate contamination rather than by mechanical strength alone. In semiconductor and electronics handling, natural unfilled TECAFIL PEEK EV natural filament is processed into wafer cassettes, IC test sockets, vacuum end-effector pads, and planarization retainers. The applicable compliance framework includes ASTM E595-15 outgassing, with total mass loss typically limited to 1.0 % and collected volatile condensable material to 0.1 %, plus SEMI S2 equipment safety and SEMI F57 for ultrapure water extractables. The formulation addition ratio for this segment is 0 wt% conductive carbon, 0 wt% glass fibre, and 0 wt% antistatic agent, because conductive particles and mobile ionic species are the primary contamination risk in wafer-adjacent tooling.
Manufacturing is performed in a filter-ventilated high-temperature FFF system with a hardened steel nozzle at 400–430 °C, a polyimide or polyetherimide build sheet at 150 °C, and a chamber held above 170 °C to suppress amorphous skin formation. Layer height of 0.15 mm and 100 % infill are used for vacuum-contact elements; after printing, a 200 °C anneal for 2 h is followed by slow cooling at ≤ 30 K/h. Dimensional stability under vacuum bake is influenced by residual crystallinity and by the anisotropic shrinkage of the as-printed body; parts machined after annealing to specified flatness reduce the risk of wafer edge slip. A critical boundary is electrostatic behaviour: unfilled natural PEEK is electrically insulating, with surface resistivity typically above 1 × 1013 Ω per ASTM D257-14, and is not suitable for ESD-dissipative wafer carriers unless converted to a carbon-filled grade or externally grounded. Terminal products include vacuum chamber fixtures, wafer alignment nests, test socket bodies, and CMP carrier inserts.
For downhole electrical connector insulators, seal backup rings, and valve seat prototypes in oil and gas service, the unfilled filament is exposed to mixed hydrocarbon, H₂S, CO₂, and hot brine environments where elastomer-free PEEK provides chemical resistance but where fused-filament boundaries can act as permeation and blister initiation sites. Compliance evaluation follows NORSOK M-710 Rev 3 for resistance to rapid gas decompression and sour fluids, in parallel with ISO 23936-1:2009 and ISO 23936-2:2011 for thermoplastic qualification in petroleum production. The feedstock is fixed at 100 wt% virgin unfilled PEEK, with 0 wt% glass fibre, 0 wt% carbon, and 0 wt% elastomeric modifier; fibre-filled grades alter RGD damage morphology and must not be substituted without re-qualification of the final printed geometry.
Processing uses a 0.4 mm nozzle at 410–430 °C, a chamber at 180–200 °C, and a bed temperature of 150 °C; the layer height is held at 0.15 mm for pressure-containing sections to reduce void channels. After the build, annealing at 200 °C for 2 h is followed by post-machining of sealing faces because the as-printed surface is not sufficient for metal-to-polymer dynamic sealing. The dominant qualification risk is not base-polymer chemical attack but interlayer gas accumulation; in sour-gas or methane service, rapid decompression can produce microblisters at layer interfaces if interlayer adhesion is incomplete. Published data for this specific configuration in sour-gas FFF components is limited, and full-scale testing on printed coupons and final parts is required. Terminal components include seal backup rings, RGD test fixtures, downhole connector insulation sleeves, and prototype ball-valve seats.
In electric drive units, the natural unfilled filament is used for high-voltage busbar retainers, sensor mounts, cell stack insulating plates, and connector housings that operate adjacent to conductors with insulation coordination requirements under IEC 60664-1:2020. Electrical tracking is measured under IEC 60112:2009, while dielectric strength is tested under IEC 60243-1:2013 on printed plaques; flame performance is assessed under UL 94 at the relevant wall thickness. The addition ratio for this grade is 0 wt% pigment, 0 wt% halogenated flame retardant, and 0 wt% impact modifier, because the natural colour package is part of the baseline electrical and flammability data set. If a coloured masterbatch or carbon-loaded variant is introduced, comparative tracking index and dielectric strength must be revalidated on printed specimens, not on raw pellets.
Manufacturing of e-mobility parts uses a high-temperature FFF system with nozzle temperature 400–420 °C, bed temperature 140–150 °C, and chamber temperature 170–180 °C; the layer height is set at 0.20 mm for larger retainers to balance build time against interlayer strength. Annealing at 200 °C for 2 h stabilises crystallinity and reduces residual stress in thick sections; cooling must not exceed 30 K/h. The practical boundary for unfilled PEEK is that printed voids and layer boundaries can reduce dielectric strength by 30–50 % compared with injection-moulded sheet, so the electrical clearances derived from solid-material datasheets require derating or direct printed-coupon verification. Terminal products include high-voltage cable retainers, interlock actuator housings, busbar insulating clamps, and temperature sensor mounts.
For centrifugal pump wear rings, valve seats, chemical dosing pump components, and filter housing inserts, the unfilled filament is selected for immersion service in polar organic solvents, dilute acids, and aqueous salt streams. Compliance is evaluated with ASTM D543-21 for chemical resistance, while environmental stress cracking is assessed under ISO 22088-1:2006 on annealed printed bars. The feedstock formulation is 100 wt% virgin PEEK with 0 wt% fibre, 0 wt% mineral filler, and 0 wt% antioxidant additive, because leachables from filler or stabiliser can invalidate the chemical compatibility profile. The natural unfilled grade is not suitable for concentrated sulfuric acid or concentrated nitric acid above moderate temperatures; service conditions must be checked against the supplier's chemical resistance chart for PEEK.
Processing for chemical-duty parts uses a hardened steel nozzle at 400–420 °C, a chamber held at 180 °C, and a bed at 150 °C; layer height is 0.15–0.20 mm and infill is 100 % for fluid-wetted surfaces. After printing, a stress-relief cycle at 200 °C for 2 h is followed by machining of wear ring clearances and sealing faces because as-printed layer roughness is unacceptable for rotary equipment. The main process conflict is the trade-off between high chamber temperature for layer fusion and the increase in crystallinity that raises strength but can also increase anisotropic shrinkage; parts with section thickness above 10 mm require slow cooling and fixture support during annealing. Terminal products include pump wear rings, valve seats, chemical dosing pump pistons, and filter housing inserts.
Конкурентоспособные цены Ensinger TECAFIL PEEK EV natural - 1,75 mm - Filament Polyetheretherketone, которые соответствуют вашему бюджету - гибкие условия и индивидуальные котировки для каждого заказа.
Для получения образцов, цен или более подробной информации свяжитесь с нами по адресу +8618136850665 или отправить по почте admin@ascent-chem.com.
Мы ответим вам как можно скорее.
Телефон: +8618136850665
Электронная почта: admin@ascent-chem.com
Гибкие условия оплаты, конкурентоспособные цены, первоклассное обслуживание — обращайтесь прямо сейчас!
Ensinger TECAFIL PEEK EV natural is a 1.75 mm diameter monofilament of unfilled polyetheretherketone produced for fused filament fabrication and other material extrusion processes. The product designation separates the grade from filled TECAFIL PEEK products: natural refers to the absence of carbon fibre, glass fibre, graphite, polytetrafluoroethylene, and inorganic pigments, while EV identifies the unfilled filament/extrusion grade within the Ensinger portfolio. Published process and mechanical data for this exact product configuration remain limited; therefore, the values reproduced here are drawn from publicly reported data for unfilled PEEK measured according to ISO and ASTM methods and should be verified against the manufacturer lot datasheet. The nominal diameter of 1.75 mm is commonly paired with a diameter tolerance of ±0.05 mm and an ovality target below 0.04 mm, values that reflect modern laser-controlled filament extrusion lines rather than a universal specification. The natural colour provides an electrically insulating, halogen-free baseline for chemical-processing, semiconductor, oil-and-gas, medical, and aerospace components, provided that the fused filament fabrication system can maintain the required thermal environment.
Polyetheretherketone belongs to the polyaryletherketone family and is synthesised from 4,4′-difluorobenzophenone and hydroquinone, yielding an aromatic backbone with ether and ketone linkages. The repeat unit contains three aromatic rings, two ether linkages, and one ketone linkage; this chain rigidity is responsible for the glass transition near 143 °C and the crystalline melting point near 343 °C. In the melt, PEEK exhibits shear-thinning behaviour. The natural unfilled grade has no reinforcing fibres to increase melt viscosity, so extrusion force through a 0.4 mm nozzle tends to be lower than for filled grades, but the melt itself remains thermally sensitive above 420 °C.
Semicrystalline order in a fused filament fabrication part is not an intrinsic constant. It depends on cooling rate, bed temperature, chamber temperature, and local toolpath reheating. Slow cooling from above 300 °C permits spherulitic growth; rapid cooling associated with small parts and unheated chambers may suppress crystallinity and lower the upper service temperature. The natural grade is particularly transparent to X-ray inspection because it lacks carbon-fibre absorption; this can simplify void detection and fibre orientation assessment, although voids remain detectable by high-resolution CT.
Polyetheretherketone is not strongly hygroscopic under ambient storage. Equilibrium moisture absorption for unfilled PEEK is generally below 0.5 % by mass at 23 °C and 50 % relative humidity, and the 24 h water-absorption value according to ISO 62 is typically 0.1–0.5 %. Despite this low bulk value, fused filament fabrication makes the material vulnerable to moisture-induced hydrolysis. The melt temperature of PEEK is 343 °C; at the hot end, the combination of temperatures above 360 °C, melt residence time, and the high surface-to-volume ratio of a 1.75 mm filament permits even 0.1–0.3 % moisture to produce chain scission. The resulting failure mode on production-scale equipment is rarely visible as steam bubbles alone. It appears as a fluctuating extrusion line width, intermittent nozzle clogging, reduced transverse tensile strength, and an increase in melt flow rate after thermal cycling. Pre-drying protocols reported for PEEK filament require 120–150 °C for 3–5 h in a circulating-air or vacuum dryer, followed by sealed storage with desiccant if ambient relative humidity exceeds 60 %. The safe threshold is therefore not a fixed moisture content; it is a function of melt temperature, residence time, and local humidity. For interrupted runs longer than 2 h in an uncontrolled environment, re-drying is the standard corrective action.
Bulk moisture measurements by ISO 62 can understate the risk because condensation forms on the filament surface and spool core before it equilibrates through the filament cross-section. On machines without a heated filament chamber, humid air entering the feed path can deposit moisture on the outer layer, producing localised hydrolysis while the core remains dry. An actively heated build chamber above 70 °C reduces uptake during printing but does not remove water already present in the feedstock. The outer diameter of 1.75 mm is small enough that the diffusion distance from surface to centre is short; this accelerates both moisture absorption and drying compared with injection-moulding pellets, but it also means that a dried spool can regain surface moisture rapidly when exposed to air at relative humidity above 60 %. Published data for the water regain rate of this specific PEEK EV natural filament is limited.
Despite the melting peak at 343 °C, a nozzle setpoint of 350–355 °C is usually insufficient for acceptable interlayer strength in PEEK fused filament fabrication. The previous layer surface cools below the crystallisation onset before the next road is deposited, particularly when layer times exceed 15 s. The interface then develops as a low-entanglement boundary with reduced Z-direction strength. On production-scale material extrusion equipment with a 0.4 mm nozzle, 0.2 mm layer height, and print speeds below 40 mm/s, sustained melt temperatures of 375–420 °C are typical for unfilled PEEK. At the upper end, thermal degradation competes with fusion. Above 420 °C, longer residence times can produce gel formation, chain branching, and an increasing melt viscosity that further destabilises extrusion. This conflict between interlayer fusion and chain degradation creates a working window of approximately 360–420 °C, but the true optimum depends on hot-end residence time, nozzle thermal stability, chamber temperature, and raster geometry. Because published data for this specific TECAFIL PEEK EV natural 1.75 mm filament at different nozzle setpoints is limited, empirical verification with a temperature tower and transverse tensile specimens according to ISO 527-2 or ASTM D638-14 is required before production release.
The build plate and chamber are part of the same fusion-control system. A bed below 120 °C often produces insufficient first-layer adhesion and edge curl as crystallisation proceeds. Heated bed settings of 150–200 °C are common for unfilled PEEK, but the adhesion surface must survive these temperatures. Polyimide film can be used up to roughly 200 °C, while carbon-reinforced silicon or textured polyimide plates may tolerate higher local temperatures but introduce surface roughness limits. An actively heated chamber above 70 °C reduces the thermal gradient between the deposited melt and the surrounding air, thereby lowering the delamination tendency. Post-print annealing at 200 °C for 2 h is sometimes applied to raise crystallinity and dimensional stability; however, it can cause dimensional change of 0.3–1.0 % and reduce ductility at high strain. The decision to anneal should therefore be made against the end-use load case rather than as a universal step.
On production-scale machines, unfilled PEEK feedstock has been observed to wear brass nozzles at a faster rate than lower-temperature thermoplastics, but less than filled PEEK. A hardened steel or high-temperature steel nozzle is commonly selected for 1.75 mm PEEK not because the natural grade is abrasive but because the same machine often alternates between filled and unfilled runs. The melt pump and extruder gear must be cleaned to avoid carbon-fibre residues from previous filled-filament jobs contaminating the natural grade.
The table below is a design-input summary for unfilled PEEK, not a substitute for lot-specific data for Ensinger TECAFIL PEEK EV natural.
| Property | Standard method | Published range for unfilled PEEK |
|---|---|---|
| Density | ISO 1183-1 | 1.30–1.32 g/cm³ |
| Tensile strength | ISO 527-2 | 90–115 MPa |
| Tensile modulus | ISO 527-2 | 3.5–4.1 GPa |
| Flexural modulus | ISO 178 | 4.0–4.2 GPa |
| Elongation at break | ISO 527-2 | 10–30 % for injection-moulded; FFF Z-direction values may fall below 10 % |
| Heat deflection temperature A | ISO 75-2/A | 152–160 °C |
| Melting temperature | ISO 11357-3 | 343 °C |
| Glass transition | ISO 11357-2 | 143 °C |
| Volume resistivity | IEC 62631-3-1 | >1015 Ω·cm |
These values are characteristic of unfilled PEEK in moulded or dense bulk form. Fused filament fabrication introduces layer interfaces and void populations that can reduce tensile properties, particularly in the Z-direction. The natural PEEK EV grade is therefore specified not only by filament diameter but by the printing environment needed to converge toward these bulk values.
Comparisons among unfilled, carbon-fibre-filled, and glass-fibre-filled PEEK filament grades are summarised below. The filled-grade values are representative literature ranges and may not correspond exactly to the Ensinger TECAFIL equivalents.
| Attribute | Unfilled PEEK EV natural | Carbon-fibre-filled PEEK | Glass-fibre-filled PEEK |
|---|---|---|---|
| Density | 1.30–1.32 g/cm³ | 1.40–1.45 g/cm³ | 1.49–1.55 g/cm³ |
| Tensile strength | 90–115 MPa | 180–220 MPa | 130–170 MPa |
| Tensile modulus | 3.5–4.1 GPa | 20–25 GPa | 9–12 GPa |
| Electrical character | Electrically insulating | Surface resistivity 10³–10⁶ Ω | Electrically insulating with filler-dependent surface behaviour |
Compared with polyetherimide, PEEK EV natural has a higher melting point and broader chemical resistance but requires a more demanding build environment. PEI may be processed at nozzle temperatures near 350–380 °C; PEEK generally requires 375–420 °C. PEKK and PEEK are chemically similar, but PEKK may exhibit different crystallisation kinetics and can be processed at somewhat lower temperatures depending on the isomer ratio. PPSU offers steam sterilisation resistance but lower tensile modulus than unfilled PEEK. The unfilled natural grade is electrically insulating, whereas carbon-fibre-filled PEEK is conductive or static-dissipative in many configurations. That difference determines whether the printed part can be placed near energised conductors or used as a dielectric barrier.
Filament diameter and roundness are decisive because feed force in fused filament fabrication is transmitted through a restricted hot-end entry. If diameter varies along the spool by more than ±0.05 mm, the extruder stepper may underextrude or overextrude. Ovality above 0.04 mm creates an asymmetric pressure distribution inside the heat break. Production-scale filament lines use two-axis laser scattering gauges and melt pumps to control diameter; the output is wound onto spools with controlled tension. Incoming inspection for this 1.75 mm PEEK EV natural product typically includes multiple diameter measurements along the spool, a roundness check at 20–25 °C, and visual confirmation of no surface contaminants. The natural grade is particularly sensitive to carbon black contamination, because carbon particles are visible and can compromise electrical insulation.
Compliance claims for PEEK materials may include food-contact, medical-use, and chemical-control obligations. Unfilled natural PEEK grades are frequently assessed under REACH, RoHS, FDA 21 CFR for food contact, and USP Class VI for medical applications, but the existence of a grade on the market does not by itself constitute a certification for all end uses. For this specific TECAFIL PEEK EV natural filament, the end user must verify that the lot-specific datasheet and the final printed part meet the relevant regulatory requirement. Published data for the printed part in body-contact devices is limited; validation must include post-processing, cleaning, and sterilisation effects.
Typical application contexts for the natural grade include manifolds, chemical-processing fittings, semiconductor wet-bench fixtures, electrical insulators, medical instrument handles, and oil-and-gas components where an unfilled PEEK baseline is needed. In all cases, the material selection is constrained by FFF-specific anisotropy: the Z-direction tensile strength of an FFF PEEK part may be only 30–60 % of the in-plane value depending on raster and chamber conditions. The natural unfilled grade has no carbon reinforcement to obscure X-ray inspection, which is a practical advantage over carbon-filled grades in void detection.
Operational boundaries are defined as much by the final part porosity as by the polymer itself. Concentrated sulfuric acid, concentrated nitric acid, and strong oxidising environments attack PEEK at elevated temperatures; exposure above 200 °C in oxidative media may embrittle the surface. In sour oil-and-gas service, PEEK has broadly accepted resistance to hydrogen sulphide and hydrocarbon mixtures, but interlayer voids may compromise sealing and permit fluid intrusion. Published data for this specific filament configuration under multicomponent sour gas, pressurised water, or sterilisation cycling is limited; validation on printed tensile bars and pressure-test coupons is required. The material is not recommended for use in contact with molten alkali metals or with fluorinating agents. No single processing condition or material property can guarantee fitness for end use.