| Код ТН ВЭД | 749577 |
Как аккредитованный ETEC (EnvisionTEC) ETEC E-ToughFlex DLP 3D Printing Polymer завод, мы соблюдаем строгие протоколы качества - каждая партия подвергается строгим испытаниям для обеспечения последовательных стандартов эффективности и безопасности.
| Упаковка | ETEC E-ToughFlex DLP 3D Printing Polymer is packaged in a 1 kg light-blocking plastic bottle with screw cap. |
| Погрузка контейнера (20-футовый контейнер) | Container Loading (20′ FCL): ETEC E-ToughFlex DLP 3D printing polymer in sealed drums, palletized, secured, labeled, with MSDS for ocean freight. |
| Доставка | ETEC E-ToughFlex DLP 3D Printing Polymer is typically shipped as a non-regulated, non-hazardous liquid resin. Use sealed, labeled containers in original packaging, protect from UV, heat, and ignition sources, and follow the current SDS. Verify UN number, hazard class, and packing group before transport. Cool, dry conditions are recommended. |
| Хранение | Store ETEC (EnvisionTEC) E-ToughFlex DLP 3D Printing Polymer in its original, tightly closed container, upright, in a cool, dry, well-ventilated area. Protect from direct sunlight, UV light, heat, sparks, and flames. Maintain 15–25°C; do not freeze. Keep away from food, drink, oxidizers, and initiators. Use secondary containment, reseal after use, avoid moisture, and follow the SDS. Keep out of reach of children. |
| Срок годности | Typically 12 months from manufacture when kept sealed in its original container, stored at 15–25°C and away from UV light. |
For low-pressure pneumatic leak-test fixtures and custom manifold gaskets, ETEC E-ToughFlex is printed as a replacement for die-cut EPDM or nitrile sheet in non-metallic sealing positions where sealing pressures do not exceed 0.7 MPa and continuous media temperature remains below 60 °C. The application-specific formulation is the same one-part urethane acrylate supplied in the cartridge; no catalyst or diluent is added because viscosity adjustment with non-reactive solvents would suppress crosslink density at the sealing face and raise compression set. Resin homogenization is required after storage periods longer than 72 h, using a low-shear spatula motion to avoid aerating the material and creating microvoids that become leak paths. Printed gaskets are produced on an Envision One cDLM with a 385 nm LED projector, using a 25 µm layer height and a 10° plan-view rotation to break pixel line artifacts on the land surface. The low surface energy polydimethylsiloxane vat film on the DLP platform reduces release force for large flexible seals and lowers the risk of green-state tearing during peeling. After printing, parts undergo three successive 99% isopropanol washes, each limited to 180 s because longer solvent immersion produces edge swelling and loss of land flatness. Following drying with filtered compressed air, parts are post-cured with a 1–2 J/cm² UVA dose in a nitrogen-purged chamber or on a reflective aluminum floor to reduce surface oxygen inhibition. Mechanical acceptance testing follows ASTM D2240-15 for durometer, ASTM D395-18 Method B for compression set at 23 °C and 70 °C, and ASTM D624-00 for tear resistance because flange rotation can initiate nicks at bolt holes. Fluid compatibility is screened by ASTM D543-14 immersion in the process fluid for 7 days; E-ToughFlex is not specified for continuous contact with strong polar solvents, ketones, aromatic hydrocarbons, or amine-based corrosion inhibitors, which can soften the urethane network. Sealing land flatness is checked with a contact profilometer after post-cure, and deviations greater than 50 µm across the land are rejected because they create a leak path under low bolt compression. Terminal components are custom-shaped gaskets, vacuum test fixture seals, and low-pressure manifold isolation pads, produced without die tooling and with dimensional repeatability governed by printer pixel pitch and layer height rather than mould wear.
Printed orthotic arch supports, prosthetic socket liner prototypes, and toe-spacer devices occupy a regulatory boundary that depends on both material chemistry and post-processing, not solely on Shore hardness. E-ToughFlex is printed at 50 µm layer height with the skin-contact surface offset from the build plane by 20° to eliminate stair-step edges that concentrate pressure against the epidermis. After the standard solvent wash sequence, a terminal UV post-cure of 1–2 J/cm² UVA is used to reduce extractable low-molecular-weight acrylate species; however, no curing protocol can eliminate the need for biocompatibility evaluation when the device contacts intact skin. Cytotoxicity screening under ISO 10993-5:2009 using L929 mouse fibroblast extract dilution and skin irritation/sensitisation testing under ISO 10993-10:2010 are the minimum data set for a disposable short-term skin-contact device; repeated-use devices require additional evaluation under the biological evaluation plan of ISO 10993-1:2018, Clause 4.1. Manufacturing for clinical use requires an ISO 13485 quality system, lot traceability from resin cartridge to post-cured part, and validated cleaning to reduce residual isopropanol below a risk-acceptable level. Process limitations are explicit: the material is not documented for mucosal contact, long-term implantation, or continuous use beyond 30 days unless a full ISO 10993 battery and clinical evaluation demonstrate otherwise. Terminal orthotic devices can be cold-disinfected with 70% ethanol or quaternary ammonium compounds; steam autoclave cycles are not recommended because the elastomeric network may undergo hydrolytic degradation at 121 °C. When lattice structures are used to tune compressive stiffness under the foot, the printed wall thickness should not drop below 1.5 mm on the skin-contact layer because thinner sections can flex too sharply and cause focal pressure points. The product is typically supplied as an off-white or amber translucent solid with 80 Shore A hardness when measured according to ASTM D2240-15, a range that suits semi-rigid orthotic shells but may require additional cushioning beneath the medial arch.
In pneumatic bellows for soft grippers and haptic feedback modules, E-ToughFlex is selected for the combination of low Shore hardness and layer-build flexibility, but cyclic fatigue is dominated by interlayer adhesion and print orientation rather than neat resin elongation. Thin-walled sections from 0.8 mm to 2.0 mm are printed at 25 µm layer height with the primary expansion axis rotated 45° from the build-platform normal so that tensile strain is distributed across both interlayer and intralayer bonds. The one-part formulation is not thinned; attempts to reduce viscosity with reactive diluents below 2 wt% are rarely justified because the heated vat system on EnvisionTEC DLP equipment maintains a stable processing window near 28–32 °C, and added diluents can shift the gel point and widen the stress-concentration zone at the layer interface. After solvent washing and post-cure, each actuator is conditioned at 23 ± 2 °C and 50 ± 5 % RH for 24 h before pneumatic cycling. Burst testing on a closed-volume tester pressurises the bellows to 1.5 times the working pressure, typically 0.2–0.5 MPa, while visual inspection records delamination at internal corners. Cyclic validation is performed at 1 Hz from atmospheric pressure to the working pressure, with a stop criterion of visible crack initiation at any layer line or a 20% reduction in blocked force. Published data for this specific configuration is limited, so acceptance limits are generated internally from printed control coupons rather than extrapolated from rigid resin datasets. Standards invoked for mechanical quality include ASTM D638-14 Type IV for tensile strength and elongation, ASTM D624-00 for trouser tear, and ASTM D412-16 for elastomeric tension set. Terminal components include pneumatic grappler bellows, inflatable haptic pads, and soft actuator sleeves for pilot automation lines.
| Application segment | Primary standard | Secondary standard | Typical test condition |
|---|---|---|---|
| Low-pressure gaskets and seal lands | ASTM D395-18 | ASTM D543-14 | Compression set 22 h at 23 °C/70 °C; 7-day chemical immersion |
| Skin-contact orthotic interfaces | ISO 10993-5:2009 | ISO 10993-10:2010 | L929 extract dilution; 48 h patch or equivalent |
| Soft robotic pneumatic bellows | ASTM D638-14 | ASTM D412-16 | Type IV tensile at 23 ± 2 °C; cyclic 1 Hz |
| Consumer electronics impact guards | ASTM D3763-18 | IEC 62368-1 | Instrumented puncture; dielectric strength |
| Under-hood clip prototypes | ISO 188 | ASTM D543-14 | 168 h thermal ageing at 60 °C; 72 h oil/ATF immersion |
| Footwear lattice midsoles | ASTM D395-18 | SATRA TM137 | 22 h static compression; repeated dynamic compression |
Impact protection for handheld metrology equipment and gimbal-stabilized camera rigs uses E-ToughFlex in lattice-filled guards and vibration-isolating mounting ears where a rigid DLP resin would transmit shock pulses to the isolated component. Components are printed at 50 µm layer height with the outer shell oriented diagonally relative to the build bed because instrumented drop testing per ASTM D3763-18 shows that impact cracks follow planar layer interfaces when the shell is parallel to the build plane. The single-component resin is processed without colourants because carbon-black pigments can reduce cure depth and produce undercured struts in dense lattice sections; if coloured parts are required, the resin supplier should confirm cure compatibility through an exposure test chip. Post-cure is limited to 1–1.5 J/cm² UVA for impact-specific parts because higher doses raise crosslink density, lower elongation, and reduce the energy absorbed before fracture. Flammability of the final part is evaluated under UL 94 HB or the applicable enclosure standard for the target device, while electrical safety follows the dielectric strength requirements of IEC 62368-1 if the printed guard is mounted adjacent to live conductors. RoHS and REACH SVHC declarations are obtained from the resin manufacturer; the final article is not certified for food contact or potable water. Damping performance is measured as a system-level decay time rather than a resin property, and prototype builds are compared on an electrodynamic shaker with a half-sine pulse at 1 m/s impact velocity. Terminal products are drop-protection guards, gimbal isolator bushing prototypes, and low-volume drone sensor mounts.
Wiring harness clips, brake-line standoff prototypes, and low-volume NVH grommets printed from E-ToughFlex are suitable only for validation environments that respect the material’s continuous temperature ceiling and non-polar fluid resistance. The part is printed at 50 µm layer height with sacrificial support contacts placed only on non-mating surfaces, because support removal from a clip latch face can leave micro-tears that reduce snap-fit retention. Post-cure is performed at 1–2 J/cm² UVA until the surface tack is eliminated; a post-cured clip should not exhibit fingerprint adhesion when handled with nitrile gloves. Thermal ageing follows ISO 188 at 60 °C for 168 h, after which tensile elongation is measured according to ASTM D638-14; the material is not specified for continuous use in proximity to exhaust manifolds where local temperatures exceed 100 °C. Chemical resistance is screened in engine oil, ATF, brake fluid, and coolant at 50 °C for 72 h under ASTM D543-14; significant volume swell or Shore A drop indicates that the environment is outside the resin’s compatibility window, and published data for this specific configuration is limited, so immersion testing is mandatory before use on any production-representative harness fixture. The final snap-fit geometry is checked with a force gauge using an insertion/withdrawal speed of 50 mm/min; a retention force below 20 N for a typical 6 mm harness bundle is considered unacceptable, but actual limits depend on vehicle OEM specifications. Compliance evidence for automotive prototypes includes UL 94 HB flammability classification and compliance with EU ELV and REACH directives; full production under-hood parts would require additional heat stabilisation and fatigue validation.
In footwear development, printed lattice midsole prototypes are used to evaluate node-and-strut cushioning concepts before injection mold tooling is cut, and E-ToughFlex provides a Shore range that better approximates a thermoplastic polyurethane foam wall than rigid acrylate resins. The resin is printed at 50 µm layer height with the strut orientation rotated 30° from the principal compression axis so that compressive loads are resolved through both layer-normal and in-plane material direction. Post-cure for footwear testing is intentionally shortened to 1 J/cm² UVA to retain elongation and to avoid the increased brittleness observed at the strut nodes after overexposure. The material’s 80 Shore A durometer, measured by ASTM D2240-15, is suitable for arch support pads and heel wedges but is firmer than a running-shoe foam, so test parts are typically printed with a gyroid or honeycomb lattice to reduce effective compressive stiffness rather than relying on bulk resin softness. Compression set under simulated wear is measured by ASTM D395-18 after 50% compressive strain for 22 h at 23 °C; repeated dynamic compression is assessed by SATRA TM137 or an equivalent internal fatigue protocol because published data for E-ToughFlex in footwear lattices is limited. Surface cleanliness for skin-adjacent sockliner prototypes requires the same residual solvent check as orthotic interfaces, and the parts are not marketed as medical devices unless they meet the applicable orthotic regulatory requirements. Terminal components include fit-check footbeds, midsole lattice demonstrations, and heel counter prototypes for low-volume wear trials.
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ETEC (EnvisionTEC) E-ToughFlex DLP 3D Printing Polymer is a photopolymer resin formulated for bottom-up and top-down digital light processing systems operating at 385 nm or 405 nm. The material is supplied as a light-amber liquid and is positioned between rigid polyurethane DLP grades and elastomeric DLP grades within the ETEC portfolio. Manufacturer-distributed technical data place typical post-cured values near 26 MPa tensile strength at break under ASTM D638-14, 110% elongation at break, 750 MPa flexural modulus under ASTM D790-17, 110 J/m notched Izod impact under ASTM D256-10, 72 Shore D hardness under ASTM D2240-15, and 55 °C heat deflection temperature at 0.45 MPa under ASTM D648-18. Green-state properties are lower and depend on solvent washout, exposure dose, and UV post-cure.
| Property | Representative value | Test method |
|---|---|---|
| Tensile strength at break | 26 MPa | ASTM D638-14 |
| Elongation at break | 110% | ASTM D638-14 |
| Flexural strength | 42 MPa | ASTM D790-17 |
| Flexural modulus | 750 MPa | ASTM D790-17 |
| Notched Izod impact | 110 J/m | ASTM D256-10 |
| Shore D hardness | 72 | ASTM D2240-15 |
| Heat deflection temperature at 0.45 MPa | 55 °C | ASTM D648-18 |
| Dynamic viscosity at 25 °C | 650 cP | ASTM D2196-15 |
| Liquid density | 1.11 g/cm³ | ASTM D4052-18 |
Representative values should be verified against the lot-specific certificate of analysis. Batch variation and post-cure equipment differences can shift elongation at break and notched Izod impact by more than 10–15%.
E-ToughFlex is separated from E-Rigid PU by its lower modulus and higher elongation. E-Rigid PU is specified for load-bearing housings, jigs, and fixtures; manufacturer-reported tensile strength is typically above 70 MPa and elongation is below 15%. E-ToughFlex is not a direct substitute for such rigid grades because its flexural modulus is below 1,000 MPa and continuous stress above 0.45 MPa can produce creep at room temperature. Compared with the elastomeric E-Flex grade, E-ToughFlex provides higher tensile strength and higher Shore D hardness but lower elongation at break; E-Flex is intended for gaskets, soft-touch overmolds, and dynamic seals where elongation above 150% and low Shore A hardness are required. The intermediate position of E-ToughFlex means it can be used for snap-fit structures that require ductile failure rather than brittle fracture, but it is not a high-HDT rigid resin and not a true low-modulus elastomer.
E-ToughFlex exhibits a dynamic viscosity near 650 cP at 25 °C under ASTM D2196-15. If the build chamber is below 20 °C, viscosity rises sufficiently to increase peel force and bubble entrapment in bottom-up DLP systems. Condition the resin to 22–28 °C before filling the vat, and allow the vat to equilibrate for at least 2 h before starting a build. Top-down DLP systems with fixed vat depth may require recirculation or periodic gentle scraping because the low green-state stiffness of E-ToughFlex can inhibit resin leveling after each layer. When relative humidity exceeds 60%, moisture absorption can lower polymerization rate and reduce final tensile strength; store the material in sealed opaque containers between print runs and use desiccant in the feed line.
Green parts are washed in ≥95% isopropyl alcohol or an ETEC-approved solvent for 5–10 min. Residual solvent can plasticize the polymer network, lowering heat deflection temperature and producing surface tack. After washout, the parts are dried at ambient temperature for 30–60 min before UV post-cure. In production lines, loading parts into a 405 nm UV flood cure while solvent remains trapped can generate internal microvoids that reduce notched Izod impact by up to 30%. Post-cure doses and chamber temperatures must be validated on the specific equipment; insufficient post-cure leaves unreacted acrylate groups that depress tensile strength and increase extractables.
| Process variable | Recommended control range | Measurement method |
|---|---|---|
| Resin temperature | 22–28 °C | thermocouple |
| Vat relative humidity | <60% | hygrometer |
| Post-cure dose | 8–12 J/cm² | UV radiometer |
| Post-cure temperature | <60 °C | thermocouple |
| Solvent washout time | 5–10 min | timer |
On a 405 nm DLP projector with measured irradiance near 4.5 mW/cm² at the build plane, E-ToughFlex may require 20–40% higher exposure time per 50 µm layer than a rigid grade with the same photoinitiator package. Underexposure produces tacky green surfaces, visible delamination, and elevated batch-to-batch variation in elongation at break. Oxygen inhibition at the vat interface in bottom-up systems contributes to the tacky appearance; top-down systems may require a nitrogen blanket or a final high-dose exposure to achieve a dry green surface. These processing parameters are machine-specific and must be bracketed using the manufacturer’s recommended starting point.
E-ToughFlex is evaluated for functional prototypes and short-run production parts such as automotive interior clips, consumer product closures, non-implantable medical device housings, and robotic gripper fingers. For living hinges, the hinge thickness should be maintained below 0.8 mm and oriented perpendicular to the build direction to limit layer-plane delamination. A 0.6 mm hinge may survive a 180° bend initially, but fatigue failure can occur below 1,000 cycles if the surface is not uniformly post-cured or if the hinge is bent across the Z-axis peel plane. Snap-fit features should use draft angles above 2° and corner radii above 0.5 mm; the notched Izod impact value near 110 J/m is relevant to sudden assembly loads, but creep under constant deflection remains a limitation because the heat deflection temperature at 0.45 MPa is only 55 °C.
Build orientation influences measured mechanical behavior. When tensile specimens are printed flat, loads are applied parallel to the layer interfaces only if the specimen is oriented horizontally; vertically oriented specimens load the layer interfaces in tension and commonly show tensile strength values 10–30% lower than XY-oriented specimens because of interlayer residual stress and incomplete interlayer conversion. The reduction is amplified in E-ToughFlex by its lower crosslink density and high elongation, which allow interlayer slip before fracture. Functional parts should place snap-fit beams and living hinges in the XY plane and avoid critical tensile features along the Z-axis. On bottom-up DLP systems with PDMS vat membranes, flexible green parts generate higher separation forces than rigid grades; larger support tip diameters and slower peel velocities are used to prevent delamination. Support consumption for E-ToughFlex builds is therefore higher than for E-Rigid PU builds.
Support removal should be performed before post-cure when the green part is still relatively soft. If supports are removed after full post-cure, the higher toughness of E-ToughFlex increases cutting force and may leave witness marks. Use flush-cut nippers or ultrasonic cutting with localized cooling to avoid heat-softening at high cutting speeds. Sanding and polishing are possible but the flexible surface can load sandpaper; wet sanding with isopropyl alcohol reduces dust and heat buildup.
Volumetric shrinkage during polymerization and post-cure affects part geometry. E-ToughFlex typically exhibits lower shrinkage than rigid DLP grades because the flexible backbone relaxes some internal stress, but shrinkage can be nonuniform in thick sections. Parts with wall thickness above 6 mm may develop sink marks or internal voids if the exposure dose is insufficient to cure through the layer. For thick cross-sections, hollow or latticed internal geometry is preferred. Dimensional accuracy is best maintained by calibrating the printer for the resin’s shrinkage coefficient and by applying uniform part orientation. Published data for this specific configuration is limited; coordinate measuring machine verification of a first-article build is recommended for tolerances below ±0.3 mm.
Tensile properties are strongly post-cure-dependent. At 405 nm and a typical post-cure dose of 8–12 J/cm², tensile strength at break can increase by 20–50% relative to a green part that has only been washed. Elongation at break may decrease as crosslink density increases, so over-curing can reduce ductility while increasing modulus. The datasheet values should be treated as a target for a specific post-cure protocol, not as intrinsic resin constants. For comparative evaluations, test specimens must be post-cured on the same equipment and with the same spectral output.
Post-cure chamber selection should match the photoinitiator absorption profile. EnvisionTEC/ETEC DLP platforms typically use 405 nm LED UV engines; post-cure units with 365 nm mercury lamps may require longer residence times if the photoinitiator absorption is weak at that wavelength. Chamber dose should be verified with a radiometer; if the dose is below 8 J/cm², tensile strength and elongation may not reach the datasheet values. Post-cure temperature above 60 °C can distort E-ToughFlex parts because the heat deflection temperature at 0.45 MPa is only 55 °C.
Failure modes observed on production DLP fleets include vat film clouding, resin gel formation in dead zones, and support base delamination. Vat film clouding can occur if an under-cured E-ToughFlex part is left in contact with the PDMS film for extended periods, because residual monomer migrates into the film. Dead zones in the vat can form gel deposits if the resin is exposed to stray UV light from the projector or sunlight; those deposits must be filtered before the next build. Support base delamination is more common with E-ToughFlex than with rigid grades due to the high peel force generated by large cross-section flexible parts.
Process stability should be monitored with tensile coupons and Shore D hardness measurements. A drop in Shore D hardness by more than 3 points may indicate under-cure or solvent retention. Viscosity drift above 20% from the fresh lot value can signal resin aging or ambient moisture uptake. Because flexible DLP resins are sensitive to post-cure, the post-cure equipment should be mapped with a radiometer at the beginning of each shift. Published data for this specific configuration is limited.
Chemical resistance and regulatory compliance must be confirmed for each application. E-ToughFlex may be supplied with statements of REACH and RoHS compliance; the current regulatory datasheet should be requested. The grade is not automatically certified for food-contact use under FDA 21 CFR 170–199 or for medical device use under ISO 10993 unless the lot-specific certificate states otherwise. Exposure to ketones, esters, aromatic solvents, or strongly alkaline solutions can swell the crosslinked network and reduce Shore D hardness and tensile strength. For chemical compatibility with fuels, brake fluids, or interior cleaners, screening under ASTM D543-14 is recommended because published data for this specific configuration is limited.
Industrial handling requires the use of nitrile gloves and eye protection; the liquid resin is a skin and eye irritant, and the solvent washout station should be explosion-proof because isopropyl alcohol is flammable. Ventilation must maintain airborne solvent below the applicable occupational exposure limit. These operational boundaries apply to the liquid resin and to post-processing operations; cured E-ToughFlex parts are not considered hazardous solids under ordinary handling.