| Код ТН ВЭД | 369693 |
Как аккредитованный завод GEHR Plastics FIL-A-GEHR PEEK Filament для 3D-печати, мы соблюдаем строгие протоколы качества - каждая партия подвергается строгим испытаниям для обеспечения последовательных стандартов эффективности и безопасности.
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For orthopaedic instrument prototyping, FIL-A-GEHR PEEK is typically dried at 150°C for 4 h in a circulating-air dryer before printing, because residual moisture above 0.15 wt% creates hydrolysis voids at the nozzle tip and produces interlayer porosity that is detectable as post-sterilisation colour shift. The feedstock remains 100 wt% unfilled FIL-A-GEHR PEEK; no radiopaque barium sulfate, carbon fiber, or processing aid is added, because additive phases alter drill-bit variance in guide holes and reduce steam-sterilisation dimensional repeatability. Compliance for limited-contact surgical instruments is assessed under ISO 10993-1:2018, ISO 10993-5:2009, and ISO 10993-10:2021, with sterilisation tolerance verified under ISO 17665-1:2006; this printed material is not supplied as an implantable-grade permanent implant. The production route uses a direct-drive fused filament extrusion machine with a 0.4 mm hardened steel nozzle, 410°C nozzle temperature, 180°C bed temperature, and 90°C actively heated chamber, printing at 0.20 mm layer height and 100% rectilinear infill. After printing, parts are annealed in nitrogen at 200°C for 2 h, slow-cooled at 1.5°C/min to 120°C, then CNC-machined to H7 hole tolerances. Production bottlenecks observed in orthopaedic line trials include interlayer delamination in parts taller than 30 mm when chamber temperature falls below 90°C, and extruder skip when batch-to-batch filament ovality exceeds 0.04 mm. Terminal product types are surgical cutting guides, alignment blocks, bone model trays, and sterilisation cassette inserts.
The failure mode most often observed in production autoclave tooling is not bulk creep but layer-plane splitting caused by residual stress relaxation after first heat-up. In autoclave curing of thermoset composite laminates, printed PEEK fixtures must hold vacuum integrity and dimensional position across repeated cycles from 25°C to 180°C at 7 bar pressure. Compliance is tied to ASTM D638-22 for tensile properties, ASTM D648-18 for deflection temperature, and UL 94 V-0 for flammability, with the manufacturing cell audited under AS9100D. Feedstock is 100 wt% unfilled FIL-A-GEHR PEEK; chopped carbon fiber or aramid filler is deliberately avoided because CTE mismatch at autoclave cure temperature induces fibre-matrix microcracks that transfer to laminate tool faces. The process uses 0.25 mm layer height, 0.50 mm extrusion width, alternating 45°/135° raster orientation, 100% solid infill, 420°C nozzle temperature, 170°C bed, and 100°C chamber; the nozzle setpoint window is held at 420±5°C, below which melt viscosity rises sufficiently to stall a direct-drive extruder producing less than 45 N·cm torque, while above 425°C off-gassing increases and may leave dark residue on the nozzle tip. After print, the tool is annealed at 220°C for 4 h before final machining to avoid post-cure hole shift of 0.3 mm in walls above 12 mm. Published data for tool volumes above 2000 cm³ is limited; machined billet PEEK may be required if vacuum bag pressure decay exceeds 2 mbar/min. Terminal part classes are composite caul plates, autoclave mandrels, vacuum bag clip frames, and drill fixture inserts.
Because ionic contamination below 1 µg/cm² must be retained after vacuum outgassing, semiconductor wafer-transport guides processed from FIL-A-GEHR PEEK are manufactured without antistatic filler; this leaves the material outside direct ESD-safe contact unless external grounding is added. The relevant compliance baseline is SEMI S2-0718, SEMI S8-0718, ASTM D257-14, and IEST-STD-CC1246E for particulate and non-volatile residue. Feedstock is 100 wt% unfilled PEEK; no carbon black or ionic surfactant is added, maintaining volume resistivity above 10¹⁵ Ω·cm but leaving surface charge decay dependent on ambient humidity. Production uses a 0.25 mm hardened steel nozzle, 0.15 mm layer height, 405°C nozzle temperature, 175°C bed, 95°C chamber, and 100% infill; after annealing at 200°C for 2 h, parts are CNC-milled to ±0.02 mm, ultrasonically cleaned in 99.9% isopropanol, and vacuum-baked at 150°C for 2 h to reduce outgassing. Terminal products include test socket lids, wafer cassette guides, probe card stiffeners, and CMP retainer ring inserts.
| Downstream scenario | Drying condition | Nozzle / bed / chamber | Annealing condition |
|---|---|---|---|
| Orthopaedic instrument prototyping | 150°C/4 h | 410°C/180°C/90°C | 200°C/2 h |
| Composite lay-up tooling | 150°C/5 h | 420°C/170°C/100°C | 220°C/4 h |
| Semiconductor wafer handling | 150°C/3 h | 405°C/175°C/95°C | 200°C/2 h |
| Downhole connector seals | 150°C/6 h | 425°C/180°C/120°C | 220°C/4 h |
| Food-contact replacement parts | 150°C/3 h | 410°C/175°C/95°C | 200°C/4 h |
| Aerospace cabin interior brackets | 150°C/4 h | 420°C/180°C/100°C | 220°C/4 h |
In high-pressure sour service, the controlling variable for printed PEEK seal retainers is not tensile strength but the void fraction at layer interfaces after annealing. Compliance for non-metallic sealing components is evaluated under ISO 23936-1:2022, NORSOK M-710:2014, and API 17D connector interfaces; because FIL-A-GEHR filament is not pre-qualified as a finished downhole seal material, customer-specific qualification under Annex B of NORSOK M-710 is required. Feedstock is 100 wt% unfilled PEEK with no plasticizer or internal lubricant; the printed retainer relies on bulk PEEK permeability and controlled layer fusion rather than an additive package for sour gas resistance. The process uses 0.30 mm layer height, 0.45 mm extrusion width, alternating 0/45/90/135° raster order, 425°C nozzle temperature, 180°C bed, and 120°C chamber; after printing, parts are annealed at 220°C for 4 h and slow-cooled to 120°C before machining O-ring grooves and thread roots. Ultrasonic C-scan is used before machining because field failures in downhole connector backshells trace to subsurface microvoids exposed during thread cutting. Published data for explosive decompression resistance of this specific filament is limited; qualification must include autoclave ageing at 150°C in a 5% H₂S, 10% CO₂, 85% methane gas mixture followed by rapid depressurisation from 100 bar. Terminal products include downhole sensor housings, electrical connector backshells, seal retainers, and coiled tubing end-effector tips.
The regulatory status of PEEK resin under food-contact law does not automatically extend to the printed part, because surface porosity and thermally degraded outer layers may act as migration sources that differ from injection-moulded resin. Compliance is evaluated against FDA 21 CFR 177.2440 for poly(ether ether ketone) resin, EU 10/2011 with an overall migration limit of 10 mg/dm², and ISO 22196:2011 for antimicrobial surface activity when CIP validation is required. Feedstock proportion is 100 wt% unfilled FIL-A-GEHR PEEK without colouring masterbatch or internal release agent; no topcoat is applied to machined contact surfaces because a coating would become an additional migration source. Production uses 0.20 mm layer height, 0.40 mm nozzle, 100% rectilinear infill, 410°C nozzle temperature, 175°C bed, and 95°C chamber; after annealing at 200°C for 4 h, contact surfaces are CNC-finished to Ra 0.8 µm, cleaned in 70% ethanol, and dry-heat validated. In food plant trials, scrapers printed with 0.30 mm layer heights showed product build-up along layer lines; only machined surfaces below Ra 0.8 µm passed clean-in-place swab recovery above 95%. Hot-oil contact above 170°C requires specific extraction screening because antioxidant migration data for this filament are limited. Terminal product types include scraper blades, valve seats, dough guides, and pump wear rings.
For cabin interior replacement parts printed from FIL-A-GEHR PEEK, heat-release and smoke-density requirements override mechanical strength at thicknesses below 2.0 mm. The compliance set includes FAR 25.853 for fire protection, ASTM E595-15 for outgassing, ASTM D638-22 for tensile properties, and UL 94 V-0 at 0.75 mm. The formulation is 100 wt% unfilled PEEK with no flame-retardant synergist; the resin achieves UL 94 V-0 in its unfilled state, and additive packages would only complicate heat-release data. Production uses 0.30 mm layer height, 0.40 mm hardened steel nozzle, 420°C nozzle temperature, 180°C bed, 100°C heated chamber, and 100% infill for load-path components; after annealing at 220°C for 4 h, parts are machined to final contour and deburred. Trials on cabin air duct brackets printed at 90°C chamber failed heat-release tier requirements when wall thickness fell below 1.5 mm, while 100°C chamber with 100% infill produced repeatable V-0 results. Published data for smoke density and toxic gas release of FIL-A-GEHR PEEK in printed cabin geometries is limited; each production run must be qualified within the installing aircraft's approved data set. Terminal product types are cabin air duct brackets, wire-harness P-clamp replacements, oven exhaust clips, and radome alignment fixtures.
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FIL-A-GEHR PEEK is an unfilled polyetheretherketone filament produced by GEHR Plastics for fused filament fabrication. The product designation appears on spool labels with diameter, color, lot number, and net weight; it is not a fiber-reinforced or mineral-filled grade. Supplied diameters are 1.75 mm and 2.85 mm, with natural and black color assignments. Typical unfilled polyetheretherketone resin exhibits a glass transition temperature of approximately 143 °C, a melting temperature of approximately 343 °C, and a density of 1.31 g/cm³ measured under ISO 1183-1. Annealed bulk specimens tested to ISO 527-2 typically show tensile strength near 100 MPa, tensile modulus near 3.6 GPa, and elongation at break near 20%. Because the filament is unfilled, its stiffness is lower than that of a carbon-fiber-filled PEEK grade, but its elongation and dielectric properties are higher. The product is therefore directed toward chemical, thermal, and electrical applications in which the absence of conductive or abrasive filler is an advantage.
The following table compares typical unfilled PEEK values with two amorphous high-temperature filament resins: polyetherimide and polyphenylsulfone. Values are typical extrusion or injection-molding data and do not replace the FIL-A-GEHR lot certificate.
| Property | Test Method | Unfilled PEEK | Polyetherimide | Polyphenylsulfone |
|---|---|---|---|---|
| Tensile strength | ISO 527-2 | 100 MPa | 105 MPa | 70 MPa |
| Tensile modulus | ISO 527-2 | 3.6 GPa | 3.0 GPa | 2.3 GPa |
| Heat deflection temperature at 1.8 MPa | ISO 75-2/A | 152 °C | 200 °C | 174 °C |
| Vicat softening temperature | ISO 306/B120 | 305 °C | 215 °C | 210 °C |
| Density | ISO 1183-1 | 1.31 g/cm³ | 1.27 g/cm³ | 1.29 g/cm³ |
Polyetheretherketone crystallizes during cooling, whereas polyetherimide and polyphenylsulfone remain amorphous after solidification. The crystalline domains create a stiffness plateau above the glass transition. Annealed unfilled PEEK retains useful load-bearing capacity above 150 °C; dynamic mechanical analysis typically records a storage modulus greater than 1 GPa at 200 °C. Amorphous polyetherimide softens more rapidly as the test temperature approaches its glass transition near 217 °C. In chemical service, PEEK shows high resistance to toluene, ketones, aqueous acid solutions, and steam. Polyetherimide is more susceptible to stress crazing in selected polar aromatic solvents, and polyphenylsulfone can soften in ketone-containing process fluids. The same semicrystalline structure changes the printing-defect pattern: PEEK develops anisotropic shrinkage and interlayer delamination if the build chamber is cold, whereas amorphous high-temperature filaments show less crystallization-induced warpage but lower solvent resistance. This distinction is the primary reason a manufacturing line selects FIL-A-GEHR PEEK rather than a lower-temperature PEI or PPSU feedstock when steam, hot acids, or polar solvents are present.
Before extrusion, the spool must be dried at 150 °C for 4 h in a forced-air dryer capable of maintaining a dew point of -30 °C or lower. Even a sealed spool can carry surface moisture, which hydrolyzes the polymer at melt temperature and produces voids. The hot end is set to 400–430 °C, the build plate to 150–180 °C, and the actively heated chamber to 120–150 °C. A hardened steel nozzle or a ruby nozzle of at least 0.4 mm diameter is required. The filament path must be all-metal; PTFE-lined heat breaks are incompatible above 260 °C, and brass nozzles creep and wear at PEEK processing temperatures. Print speed is held between 30 mm/s and 50 mm/s, with layer height from 0.15 mm to 0.25 mm. Part-cooling fans are disabled or limited to 10% duty, and the first layer is commonly deposited on a high-temperature bed adhesive or a PEEK raft. Conventional low-temperature support materials do not bond to PEEK at these bed temperatures; support structures are printed in the same PEEK material and removed mechanically after the build.
The first observable defect is interlayer delamination, followed by corner lifting and first-layer separation. The crystallization window for unfilled PEEK lies between approximately 170 °C and 280 °C. If the chamber remains below 90 °C, each deposited bead cools below the glass transition temperature before the next layer can interdiffuse. The weld line freezes with spherulitic boundaries, and residual stress concentrates at the interface. Published interlayer tensile strength values for fused filament PEEK are process-dependent; reported values typically range from 35 MPa to 70 MPa, while annealed bulk PEEK specimens reach approximately 100 MPa under ISO 527-2. The deficit is caused by limited polymer chain diffusion across the printed weld line. Chamber heating to 120 °C or higher reduces the cooling rate and allows more complete interlayer fusion before crystallization arrests chain mobility. Build plate temperatures above 150 °C are also necessary to prevent first-layer contraction. Parts with large flat bases or thick cross sections are most sensitive because the internal thermal gradient increases with part height.
Unfilled PEEK absorbs less than 0.5% water over 24 h immersion according to ISO 62. That low equilibrium uptake is still sufficient to produce hydrolysis and porosity when the material is heated above 100 °C without prior drying. The influence of moisture is not limited to surface bubbles; hydrolytic chain scission reduces melt viscosity and final molecular weight, which degrades toughness and fatigue resistance. Spools should be returned to sealed storage with desiccant after use, and material stored at ambient humidity above 60% RH should be re-dried before the next build. The same handling rule applies to filament left in an unheated printer cabinet for more than 24 h. For high-temperature printing, a weight-loss moisture analyzer or a dew-point sensor in the dryer provides a better release criterion than visual inspection alone.
Unfilled PEEK undergoes anisotropic shrinkage as it crystallizes. Printed solid sections typically contract 1–2% in the build plane and more in the z-axis because the layer interfaces do not pack at full bulk density. Post-print annealing at 200 °C for 2 h raises crystallinity and can increase strength and chemical resistance, but it also produces additional dimensional change. Unconstrained annealed parts may curl, especially in walls thinner than 3 mm. Differential scanning calorimetry of as-printed PEEK frequently shows cold crystallization if processing has quenched the part below equilibrium crystallinity; the subsequent anneal stabilizes the melting endotherm and reduces residual stress. When a tolerance tighter than ±0.25 mm is required, the part is annealed on a rigid fixture and the shrinkage vector is characterized on a sacrificial print because the exact value depends on raster angle, infill density, and chamber temperature. Thermal post-processing should be performed in a convection oven with over-temperature cut-off and exhaust ventilation to control volatile release and oxidation.
Chemical-processing components, semiconductor wafer fixtures, autoclave trays, and oilfield tooling are produced from unfilled PEEK filament when the part must resist steam at 134 °C, hot aqueous acids, and aliphatic hydrocarbons. The material is not suitable for concentrated sulfuric acid, concentrated nitric acid, or strong oxidizing halogen gases; these media attack the aromatic backbone and can cause chain scission. For medical applications, unfilled PEEK resin is commonly evaluated under USP Class VI and ISO 10993-5, but printed components require cleaning, thermal post-processing, and validation because porosity and surface contamination can alter in vivo performance. Under the European chemicals framework, unfilled PEEK is generally outside the restrictions of RoHS 2011/65/EU and does not require an SVHC declaration under REACH 1907/2006, provided the starting resin and colorants meet those obligations. For electrical housings, unfilled PEEK typically carries a UL 94 flame rating of V-0 at 1.5 mm and a comparative tracking index of 150 V; these values are batch-dependent and must be confirmed on the product certificate.
Compared with reinforced PEEK filaments, the unfilled FIL-A-GEHR PEEK grade presents lower tensile modulus and lower wear resistance but higher elongation at break and better electrical insulation. In semiconductor or chemical service where metallic contamination from wear debris is undesirable, the unfilled grade avoids short carbon-fiber particles and reduces abrasive wear on the nozzle. The trade-off is that unfilled PEEK has lower dimensional stability under high mechanical load; parts requiring maximum stiffness at elevated temperature are better produced with a carbon-fiber-filled grade if the process permits higher nozzle wear and reduced ductility.