| Код ТН ВЭД | 275305 |
Как аккредитованный завод Lehvoss LUVOCOM 3F PEKK 50082 NT PEKK для аддитивного производства, мы соблюдаем строгие протоколы качества - каждая партия подвергается строгим испытаниям для обеспечения последовательных стандартов эффективности и безопасности.
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In aircraft cabin air distribution systems, LUVOCOM 3F PEKK 50082 NT is printed into curved duct adapters, mixer nozzle housings, and bracket reinforcements using a fused filament fabrication cell that maintains a chamber air temperature between 160 °C and 180 °C. The filament is dried in a desiccant dryer at 120 °C for 4 h to a dew point at or below -40 °C before the first layer is deposited. A 0.4 mm hardened-steel nozzle and a 0.15 mm layer height are selected to limit extrusion backpressure while preserving interlayer diffusion. The extrusion multiplier is held between 0.98 and 1.02 to prevent over-extrusion porosity at toolpath reversals. Print-bed adhesion on carbon-filled PEI or PTFE-coated glass is used for flat duct flanges; rafts are avoided because removal can introduce microcracks at the first-layer interphase.
Process conflict arises when the chamber setpoint fluctuates by more than ±5 °C during a build longer than 18 h. The PEKK matrix crystallizes unevenly if the deposited bead cools below the glass transition of roughly 162 °C before the subsequent pass, producing residual stress that lifts the flange corners. Machine-level mitigations include active chamber recirculation, proximity of the extruder to the part surface, and a part-to-door distance greater than 120 mm to avoid cold-air pulses. Published data for this specific Lehvoss grade in bleed-air duct service is limited; process validation therefore uses a sacrificial first article with IR thermography and sectioned coupons.
Cabin interior compliance is evaluated under 14 CFR 25.853(a) Appendix F Part I vertical burn and, for large surface panels, under 14 CFR 25.853(d) heat-release limits of 65 kW/m² peak and 65 kW·min/m² total for a 2 min test. PEKK forms a thermally stable char that resists dripping, but the printed surface texture must be sanded or vapor-smoothed before testing because protruding layer lines can behave as wick points during ignition. Density and void fraction are measured by ASTM D792-20; aerospace processors typically reject duct sections with void content above 2 % by volume because voids become crack initiation sites under cabin pressure cycling from 0.75 atm to 1.0 atm.
Post-print annealing is performed in a forced-air oven at 200 °C to 230 °C for 2 h with the part constrained in a stainless-steel fixture that replicates the installation bolt pattern. The anneal raises crystallinity, reduces locked-in shrinkage, and stabilizes the geometry before dimensional inspection. Terminal parts include passenger service unit housings, cabin air inlet adapters, and low-pressure duct flanges that are joined to metallic structure with mechanical fasteners rather than adhesive bonding unsupported by qualification data.
| Application segment | Nozzle diameter (mm) | Layer height (mm) | Chamber setpoint (°C) | Fill strategy |
|---|---|---|---|---|
| Aircraft air duct | 0.4 | 0.15 | 160–180 | 100 % solid |
| Medical guide | 0.25 | 0.10 | 150–170 | 100 % solid or 65 % gyroid outer |
| Oilfield preform | 0.6 | 0.25 | 150–170 | 100 % solid + contour offset |
| Chemical pump shim | 0.4 | 0.15 | 160–170 | 100 % solid |
Preoperative cutting guides and maxillofacial trial spacers are produced from LUVOCOM 3F PEKK 50082 NT with a 0.25 mm nozzle and a 0.10 mm layer height when the guide slot must receive a 1.0 mm osteotomy burr. This parameter set reduces stair-step interference at the slot wall but extends build time compared with the 0.4 mm nozzle default. The build platform is maintained at 140 °C to 160 °C, and the chamber is kept sealed to prevent rapid surface crystallization before the adjacent toolpath is placed. Solid fill is used in the guide slot region; the outer body can use a 65 % gyroid fill only if the device is not load-bearing during osteotomy, but many production shops prefer 100 % solid fill to eliminate sterilizer condensate retention.
Steam sterilization is performed according to ISO 17665-1:2006 at 121 °C for 30 min or 134 °C for 4 min, with drying phases not exceeding 115 °C to avoid annealing the material in the pouch. Cytotoxicity and sensitization are evaluated under ISO 10993-5:2009 and ISO 10993-10:2010 as part of device-level biocompatibility, not solely from resin certification. The NT natural grade avoids pigments that can complicate leachables testing, but any release agent, cleaning solvent, or fiber-handling aid introduced in the print room must be disclosed in the biological evaluation plan.
Dimensional checks after 50 simulated autoclave cycles are performed on a coordinate measuring machine with ±0.05 mm process capability. The relevant failure mode is not gross distortion but localized slot widening caused by relaxation of print residual stress once the guide is exposed to steam above 100 °C. Terminal products include implant trial sizers, removable oral surgery guides, and sterilizable drilling templates that are disposed after patient-specific use or resterilized only according to hospital protocol.
For sour-gas wellhead tooling, LUVOCOM 3F PEKK 50082 NT is printed into thick-walled cylindrical preforms that are then finish-machined on a CNC lathe to hold radial sealing geometry. The additive step uses a 0.6 mm nozzle and a 0.25 mm layer height to reduce build time, because the subsequent machining pass removes 1.5 mm to 2.0 mm of as-printed stock. Chamber temperature is controlled at 150 °C to 170 °C to maintain interlayer diffusion through the full wall thickness. Sparse infill is not permitted; the print is 100 % solid with contour offset adjusted so that no internal voids are carried into the seal face.
Sour-gas service compatibility is evaluated according to ISO 23936-1:2022 for non-metallic materials and, where required, NORSOK M-710 for rapid gas decompression resistance. The material is exposed to a methane/H₂S/CO₂ gas mixture at the end-use temperature before pressure release, and the specimen is sectioned for internal blister inspection. Published data for this specific PEKK grade in high-blister H₂S environments is limited; qualification programs therefore include a control run with a machined PEKK reference to separate additive process effects from polymer intrinsic performance. Terminal products include API 6A gate-valve backup rings, downhole packer seal supports, and electrical connector insulators rated for continuous service at 150 °C.
| Application segment | Standard or regulation | Test condition | Acceptance criterion |
|---|---|---|---|
| Aerospace cabin | 14 CFR 25.853(a) | 60 s vertical Bunsen burner | Self-extinguishing; OEM burn length limit |
| Aerospace panel | 14 CFR 25.853(d) | 2 min OSU | 65 kW/m² peak / 65 kW·min/m² total |
| Medical guide | ISO 10993-5:2009 | Cell culture extract | No cytotoxic potential |
| Sour gas seal | NORSOK M-710 | Rapid gas decompression | No internal blistering |
| Semiconductor part | ASTM E595-15 | 125 °C vacuum | TML 1.0 %, CVCM 0.10 % |
| EV busbar | UL 94 V-0 | 0.8 mm thickness | Self-extinguish; no flaming drips |
LUVOCOM 3F PEKK 50082 NT is converted into near-net pump wear rings and impeller shims for centrifugal pumps handling aromatic hydrocarbons, ketones, and hot demineralized water. The printed blanks are machined to the required clearance after annealing, because as-printed shrinkage can alter ring-to-shaft clearance by 0.10 mm to 0.20 mm on diameters above 80 mm. A 0.4 mm nozzle and 0.15 mm layer height are used with 100 % solid fill to minimize through-porosity. The anneal cycle at 220 °C for 2 h is followed by slow cooling at 1 °C/min to avoid introducing a differential crystalline skin. Chemical resistance is process-stream specific and should be confirmed by immersion testing according to ASTM D543-21 or ISO 175:2010. The main process boundary is strong oxidizing acids; PEKK is not recommended for fuming nitric acid or hot concentrated sulfuric acid above 90 % at process temperature without specific validation. Terminal products include pump wear rings, turbine impeller shims, valve poppets, and instrument isolation diaphragms that replace metallic parts in low-shear corrosive transfer lines.
In semiconductor wet-bench applications where metallic tooling is excluded from acid tanks, the unfilled natural grade is selected because it avoids carbon filler particle release and metal-oxide contamination associated with pigmented or ESD-modified compounds. The print cell is operated under HEPA-filtered air with no exposed gear lubricants; the filament is wiped with isopropanol and dried at 120 °C before entering the extruder. A 0.25 mm nozzle and 0.10 mm layer height are used for end-effector surfaces that contact wafer edges, while larger alignment nests use 0.4 mm and 0.15 mm to reduce build time. All parts are annealed at 210 °C to 230 °C for 2 h and then vacuum-baked at 150 °C for 8 h to strip residual moisture before cleanroom release.
Outgassing is tested under ASTM E595-15 with acceptance commonly set at total mass loss below 1.0 % and collected volatile condensable material below 0.10 %. Surface cleanliness and ionic contamination are verified by deionized water extraction and ion chromatography before the parts enter the fab. Compatibility with clean-cycle baths such as dilute hydrofluoric acid and SC-1 solution is confirmed by ASTM D543-21 immersion before the tool is placed in production. Terminal products include wafer transport nests, cassette end-effectors, and wet-bench tank inserts that replace polyvinylidene fluoride or polyether ether ketone components for specific high-temperature rinse steps.
Battery-busbar insulators and power electronics spacers for electric vehicle prototypes are produced from LUVOCOM 3F PEKK 50082 NT for short-run validation before injection molding. The printed material is operated at continuous use temperatures near 180 °C, but that condition requires an annealed part; an unannealed print can show progressive dimensional relaxation above 200 °C because residual stress and low crystallinity coexist. The part is printed with a 0.4 mm nozzle, 0.15 mm layer height, and solid fill, then annealed at 220 °C for 2 h. Insulating performance is checked according to ASTM D149-20 at 2.0 mm specimen thickness, and flammability is evaluated to UL 94 V-0 at 0.8 mm or end-use thickness.
The main process conflict is dielectric loss at layer interfaces after thermal cycling from -40 °C to 180 °C. If the chamber temperature during printing is below 150 °C, micro-voids form at the interlayer boundary and increase partial discharge risk in high-voltage busbar spacers. Peel adhesion between layers can be measured by double cantilever beam testing, but many EV qualification programs instead section the busbar support, vacuum-impregnate with a low-viscosity dyed resin, and inspect for penetration depth. Terminal products include busbar support brackets, cell spacer plates, and high-voltage cable clips that are replaced by machined or molded parts once the design freezes for volume production.
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Lehvoss LUVOCOM 3F PEKK 50082 NT PEKK for Additive Manufacturing is a natural, unfilled polyetherketoneketone feedstock formulated for fused filament fabrication (FFF) and high-temperature melt-extrusion additive manufacturing platforms. The designation separates the material into the LUVOCOM 3F additive-manufacturing portfolio, the PEKK base-polymer class, the 50082 internal formulation code, and the NT natural-tone indicator. Polyetherketoneketone belongs to the polyaryletherketone family and contains two ketone linkages per ether group in the aromatic backbone; polyetheretherketone contains an alternating ether-ketone sequence. This structural difference increases ketone content and allows the ratio of terephthaloyl to isophthaloyl units to be adjusted, thereby shifting melting point, crystallization rate, melt viscosity, and final crystalline morphology. The grade contains no carbon fibre, glass fibre, conductive carbon black, or pigment dispersion. The absence of fillers preserves the chemical character of the base resin and reduces hard-particle abrasion in the hot end and filament drive unit.
The feedstock is supplied as continuous round filament in diameters commonly including 1.75 mm and 2.85 mm, with diameter tolerance and roundness controlled for consistent feeding through high-temperature extruder drive gears. Because PEKK is hygroscopic, storage in sealed containers with desiccant is required. Before processing, the filament is dried to a target residual moisture below 0.02 wt%; higher moisture levels during melt extrusion produce hydrolysis, microvoid formation, and reduced interlayer wetting. The unfilled natural product is not a conductive or static-dissipative grade, and it is not formulated as a medical implant material unless a separate validation against ISO 10993-1 is completed.
The controlling variable is crystallization rate. PEKK can be formulated with a wider thermal interval between melt rheology and crystallization than PEEK, which allows polymer chains to diffuse across the printed layer interface before solidification traps the interface. The glass-transition temperature of PEKK commonly falls between 155 °C and 165 °C; unfilled PEEK typically exhibits a glass-transition temperature near 143 °C. The melting point of PEKK varies from approximately 300 °C to 360 °C depending on terephthaloyl-to-isophthaloyl ratio, while PEEK melts near 343 °C. On heated-chamber FFF systems, the broader PEKK solidification window can reduce warpage and horizontal cracking during deposition. However, this same behaviour means that the printed part leaves the build cycle with incomplete crystallinity and must be annealed at 200–220 °C to achieve the expected thermal and mechanical properties.
Compared with PEEK, PEKK offers a different balance of compressive response and melt solidification behaviour. Melt-flow comparison must be carried out under the same temperature and load, typically ISO 1133-1:2022 at 380 °C with 5 kg. PEKK is not a direct drop-in substitution for PEEK in FFF; nozzle temperature, chamber setpoint, cooling airflow, and z-offset require separate optimization.
The following envelope is drawn from published values for unfilled PEKK FFF feedstock and is not a product specification. Release-lot data for Lehvoss LUVOCOM 3F PEKK 50082 NT must be obtained from the supplier datasheet before engineering design or qualification.
| Property | Test method | Typical envelope | Comment |
|---|---|---|---|
| Density | ISO 1183-1 | 1.28–1.31 g/cm³ | Unfilled PAEK feedstock |
| Tensile strength | ISO 527-2 | 85–105 MPa | XY orientation |
| Tensile modulus | ISO 527-2 | 3.0–3.9 GPa | Raster-angle dependent |
| Flexural strength | ISO 178 | 120–160 MPa | Static bending |
| Heat deflection temperature | ISO 75-1/-2 at 1.8 MPa | 240–300 °C | After annealing |
Tensile qualification should use ISO 527-2 specimen geometry with raster orientations representative of the production part. Because FFF parts are orthotropic, a single XY value does not define build-direction strength. Testing should include 0°, 90°, and ±45° raster patterns; if Z-strength is safety-critical, vertical coupons built in the Z direction are required. Differential scanning calorimetry per ISO 11357-3 can be used to compare as-printed and annealed crystallinity. For unfilled PEKK, as-printed crystallinity is typically below the annealed level, which reinforces the need for thermal post-treatment.
Drying at 150 °C for 4–6 h in a dry-air dryer with dew point below −40 °C or in a vacuum oven is applied before extrusion. If the filament is exposed to relative humidity above 60 % for more than 1 h, re-drying is required. Moisture-induced hydrolysis at melt temperature can reduce molecular weight and generate gas bubbles at the nozzle tip, creating intermittent extrusion and a weak interlayer boundary.
Representative starting parameters for unfilled PEKK on a high-temperature FFF platform are nozzle temperature 360–390 °C, build-plate temperature 150–180 °C, and heated chamber temperature 90–150 °C. The hot end must be all-metal and equipped with a hardened steel or tungsten carbide nozzle; brass nozzles are unsuitable for sustained operation above 300 °C. Nozzle bores in the range 0.4–0.8 mm and layer heights of 0.15–0.30 mm are typical. Larger layer heights increase throughput but reduce the bonded contact area between adjacent beads. Build surfaces such as unfilled PEI sheet, polyimide film, or ceramic plate are used; first-layer calibration and chamber temperature determine adhesion.
After deposition, annealing in a circulating-air oven at 200–220 °C for 2–4 h with heating and cooling rates not exceeding 1 °C/min is used to develop crystallinity and reduce residual stress. Annealing produces anisotropic shrinkage, so dimensional correction factors must be generated with witness coupons placed in the same orientation and thermal fixture configuration as the production part. Inspection by dimensional metrology or computed tomography can be used to confirm that the annealed part remains within geometric tolerance.
On production-scale high-temperature FFF systems with actively heated chambers, the highest interlayer fracture risk is seen in large parts near chamber door seals or in regions with poor recirculation. If local chamber temperature falls below approximately 90 °C, PEKK solidifies more rapidly and the interlayer boundary retains less chain interdiffusion, producing a horizontal crack parallel to the build plane. The crack often initiates at a sharp section transition or internal corner and propagates under residual stress. Corrective actions include raising the chamber setpoint, preheating the chamber for 30–60 min, repositioning the part away from door seals, reducing layer height, and increasing extruder temperature within the upper portion of the recommended range.
Incoming lot qualification for filament can include melt-volume-flow rate testing at 380 °C and 5 kg per ISO 1133-1:2022. A significant increase in MVR compared with the control lot can indicate lower molecular weight or thermal degradation; a decrease can indicate moisture-induced hydrolysis during extrusion. Karl Fischer titration can be used to confirm residual moisture after drying and before the spool is placed on the machine.
With a partially heated or passively enclosed build volume, unfilled PEKK remains processable only when the part footprint is limited and deposition speed is reduced. The process limit is the ability to keep the part surface temperature above the glass-transition region during bead solidification. Long beads lose heat quickly without active chamber heating, causing non-uniform crystallization and upward curling. Curling can be reduced by increasing build-plate adhesion, reducing raster length, adding sacrificial brim structures, and reducing deposition speed below 40 mm/s. Published data for this specific configuration are limited; controlled part trials on the target machine are required to establish maximum build size and Z-strength values.
For small parts with simple geometry, a heated bed at 150–180 °C and a passive enclosure may produce acceptable interlayer strength if the part is annealed at 200–220 °C after printing. This approach is not equivalent to an actively heated chamber at 120 °C or higher, particularly for sections thicker than 5 mm where internal residual stress accumulates.
The unfilled natural grade differs from carbon-fibre-reinforced LUVOCOM 3F PEKK compounds in stiffness, wear behaviour, electrical conductivity, and abrasion of nozzle tooling. Carbon-fibre-filled PEKK can raise tensile modulus above 5 GPa under ISO 527-2, whereas this unfilled grade remains electrically insulating and less abrasive to the nozzle. The natural tone avoids titanium dioxide and carbon black pigments, which is relevant where pigment-related outgassing or contamination is undesirable. In sliding contact, however, the unfilled composition has lower wear resistance and lower thermal conductivity than filled alternatives.
Compared with black or pigmented PEKK filaments, the natural grade permits direct visual inspection of voids, inclusions, and layer fusion in thin sections. The natural unfilled grade is not formulated for long-term UV-stabilized outdoor exposure and does not provide static dissipation or EMI shielding. Those functions require conductive compounding or secondary processing.
The following compliance positions reflect unfilled natural polyaryletherketone feedstock in general; the supplier declaration for the specific 50082 NT lot must be consulted before product qualification.
| Regulatory framework | Reference | Typical status | Verification step |
|---|---|---|---|
| RoHS Directive | 2011/65/EU as amended by (EU) 2015/863 | Unfilled natural compound typically complies | Supplier declaration |
| REACH | EC No 1907/2006, Article 33 | No intentionally added SVHC above 0.1 wt% | SDS review |
| Biocompatibility | ISO 10993-1 | Not claimed unless final device validation completed | Material and device testing |
| Food contact | EU Regulation (EU) No 10/2011 | Not automatically compliant | Migration testing on final article |
Applications for unfilled natural PEKK are typically aerospace ducting brackets, oilfield downhole tool housings, semiconductor wafer-handling fixtures, and medical instrument components requiring repeated steam or chemical sterilization. In steam sterilization cycles at 134 °C per ISO 17665, polyaryletherketone grades generally retain mechanical stiffness, but the final device must be validated under the intended sterilization enthalpy and clamp loads. This grade is not recommended for direct food-contact surfaces, implantable devices, or conductive charge-dissipation applications without additional material selection or testing. For wear-resistant or conductive surfaces, filled LUVOCOM 3F PEKK grades or post-process coatings should be evaluated.